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A fluxless process of bonding silicon to Ag-cladded copper using electroplated In-Ag multilayer structure is developed. The Ag cladding on the copper substrate is a stress buffer to deal with the large mismatch in coefficient of thermal expansion (CTE) between semiconductors such as Si (3 ppm/degC) and Cu (17 ppm/degC). To manufacture Ag on copper substrate, two techniques are developed. The first...
New fluxless hermetic sealing technique is reported using electroplated Sn-rich soft solder. Specific type of glass (SCG72) is chosen as a lid material to be sealed onto the alumina ceramic package to deal with thermal expansion mismatch. This glass has nominal coefficient of thermal expansion of 7ppm/degC, which is almost perfectly matching to that of alumina ceramic package. Thick Sn layer is plated...
In nearly all soldering processes, it is the intermetallic (IMC) layer that bonds the solder to the base metal. Thus, the IMC layer is necessary for any successful soldering operation used in the electronic industry. That is, a solder joint always has at least one IMC layer. While the IMC layer is needed, it is not static. It grows in subsequent reflows and during aging with time. Its growth without...
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