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This paper presents a monolithic three axial electrochemical micro seismic sensor. In response to the vibration along different axes, the outputs of four sensing units are different and through the decoupling of the differences between them formed by different vibration, the vibration along a certain axis can be detected from the mixed one. Because of the decoupling sensing mechanism with four sensing...
Gallium Nitride (GaN) transistors are emerging as promising candidates for making high-frequency, low-loss and small-size power converters. To realize normally-off, p-GaN gate technique is widely adopted in commercially available GaN-based power devices. However, owing to the distinctions in device structure, the intrinsic capacitances with regard to gate region vary from those of Si MOSFET. Besides,...
The Standards Group of the IEEE Industrial Electronics Society (IES) has been active in standards for industrial electronics in recent years, focusing on sensors and sensors networks, real-time industrial communications and industrial agents in the automation fields. It has also participated and collaborated with other IEEE societies such as the Instrumentation and Measurement Society (IMS) in the...
Industrial Internet of Things (loT) brings more innovation space to the construction machinery industry. However, currently the application of IoT in vibratory roller is mainly reflected on the remote control of asset security and the basic data monitoring of equipment operation. In order to improve the intelligent level of vibratory roller and promote intelligent compaction on road construction,...
We demonstrate a flexibly controllable molding of electromagnetic waves by designing magnetic metamaterials and metasrufaces with an array of ferrite rods under a particularly arranged bias magnetic field. The manipulation is accomplished for both the spatially propagating waves and the surface waves confined at the interface. Nonreciprocal properties associated with the magnetic surface plasmon resonance...
This paper develops an iterative searching method to find the optimal power management strategy and component sizes for a hybrid power system that consists of a proton exchange membrane fuel cell, a chemical hydrogen production system, photovoltaic arrays, and a Li-Fe secondary battery set. In order to find the most suitable power management and component sizes, we build a MATLAB/SimPowerSystem simulation...
Nb5N6 bolometer is a high sensitive terahertz detector at room temperature. The core part of traditional Nb5N6 bolometer is microbridge with a typical size of 3 μm × 12 μm. We have recently proposed a method using electron beam lithography (EBL) instead of UV lithography on fabrication of Nb5N6 micro bridge, which will reduce the size of the micro-bridge one to two orders of magnitude, the minimum...
The interfacial intermetallic compound (IMC) is a crucial factor for solder jointing reliability assessment and a suitable IMC layer size guarantees the quality of solder joints. On one hand, the interfacial grains keep growing with reaction time during soldering; On the other hand, with the coming universal application of 3D electronic packaging in modern electron industry, multiple reflows become...
We design a T-shape structure reflecting mirror covered a gold thin film on the high-resistivity silicon substrate (ρ=1000 Ω·Cm) for the detector array. The electric field distribution of the T-shape structure is simulated by using finite difference time domain (FDTD) solutions in the frequency range from 300 GHz to 400 GHz. The electric field can be gathered in the central area of the silicon substrate...
Terahertz (THz) direct detectors based on superconducting niobium nitride (NbN) hot electron bolometers (HEBs) with microwave (MW) injection have been studied. Compared to the thermal biasing method, the injected MW is used here to bias the HEB to the optimum point. MW can be expected to be used as the easy read out for the detecting array. The used NbN HEB has an excellent performance as heterodyne...
An layer of Cu6Sn5 intermetallic compound (IMC) is formed during the interfacial reactions between lead-free solder and Cu substrate, and it plays a pivotal role in the reliability of solder joint. There are two different growth morphologies of Cu6Sn5 grains-scalloped grain and prism grain. Scallop grains are commonly formed at the interface during the heating up and isothermal heating. Its growth...
Conductive atomic force microscopy (CAFM) was used to investigate nano-electric performances of semiconductor MOS (metal-oxide-semiconductor) devices. Due to the small tip size (as small as ∼20 nm for PtSi probes), CAFM is capable of imaging both topography and current information of nano-device structures simultaneously with very high lateral resolution. Due to the use of wide ranges of current amplifier...
For the first time, the ion-vacancy-based bipolar RRAM has been demonstrated on HKMG stack of FEOL logic 14nm FinFET. A unit cell with two identical FinFETs, one serves as a control transistor and the other one is the storage with resistance switching. It is performed by the edge tunneling and with bipolar switching. More importantly, the sneak path issue in an AND-type array based on this FinFET...
This paper reports a high-Q resonant pressure micro sensor with through-silicon-via electrical interconnections. Double "H" type resonators were arranged in a differential pressure sensor where the pressure under measurement was translated to resonant frequency output. The resonators were vacuum packaged through anodic bonding, which produced a high Q factor of the resonators. In order to...
This paper firstly presents an integrated three-axis electrochemical micro seismic sensor, which consists of four sensing units. The direction of the flow is opposite in different channel so that differential current can be calculated. Vertical vibration can also be detected by the addition of the output from four sensing units. Instead of huge volume in conventional three-axis sensor, the integrated...
A new, efficient electron field emitter geometry, based on monolayer graphene coated well aligned Mo tip arrays, is here reported. The rather anomalous, yet nonetheless beneficial contributions of this hybridized nanostructured film morphology is evaluated and discussed. Efficient and stable field emission with low turn on fields has been observed. Incorporation of graphene and Mo tip array results...
Recent advances in integrated opto-electronic devices and front end circuits have made it possible to efficiently transmit very high data rates over optical links for HPC/datacenter applications. This paper reviews our current progress towards serial 100-Gb/s optical interconnects, with emphasis on electrical duobinary (EDB) modulation.
This paper demonstrates the first reliable and low cost airgap BEOL technology, generated at extremely tight dimensions (48 nm pitch) in Cu/ULK. This provides 20% nested-line capacitance reduction relative to the ungapped Cu/ULK baseline. This result is of critical importance, as it validates that airgaps can be extended down to ultrafine wire levels, such as for the 10 nm technology node. Current...
In this work, we developed an effective technique to form a sharp and stable crystalline oxidation interlayer (COIL) between the reliable LPCVD (low pressure chemical vapor deposition)-SiNx gate dielectric and recess-etched GaN channel. The COIL was formed using oxygen-plasma treatment, followed by in-situ annealing prior to the LPCVD-SiNx deposition. The COIL plays the critical role of protecting...
In this paper, an IGBT gate driver IC with a collector current sensing circuit and an on-chip CPU for digital control is presented. The IC is fabricated using TSMC's 0.18 μm BCD Gen-2 process. This technique is based on the unique Miller plateau relationship between the gate current and collector current (Ig and IC) for a particular gate resistance (Rg), and allows for a cycle by cycle measurement...
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