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It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint, particularly in impact loading. There is another level of concern when the Cu-rich Cu3Sn phase starts to...
Sintered silver is being increasingly recognized as an ideal method of joining in situations where a relatively low temperature process is required to form a bond that can survive service at elevated temperatures, e.g. in the mounting of power semiconductor dies. In the optimization of this process much consideration is given to the parameters of the sintering stage but the integrity and reliability...
The commercial success as Pb-free solders of alloys based on a trace addition of Ni to Sn-0.7Cu and the academic recognition of the metallurgical effects that deliver the excellent performance in soldering processes and in service, means that Sn-Cu-Ni is now well established as one of the main alloy systems on which the electronics industry depends for the assembly of reliable circuitry. One important...
Solar and electric vehicles offer a sustainable future for the automotive industry and demonstration events offer realistic conditions to test and demonstrate the technology involved. We produced a four wheel solar car “Arrow1” by adopting a variety of appropriate technologies. These include the use of a lead-free solder alloy (Sn-Cu-Ni-Ge) in connections of the electric circuit boards of controllers,...
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