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This paper analyzes the formation energy and electronic structure of Li-N co-doped diamond by the method of the first-principles density-functional theory (DFT). We found that the Li-N co-doped diamond shows the shallow donor level mainly contributed by the N-2s states and N-2p states for the first time. Meanwhile, the doping efficiency of Li in diamond can be improved by the introduction of N atom...
The nonlinear response of silver nanoparticles filled epoxy resin composites under increasing applied voltage is investigated. The influence factors of applied high voltage on the conductivity of composites are measured by the collection of the electric current passing through the sample. With the increase of applied voltage, the composite has a nonlinear conductive characteristic. The contributing...
The hybrid material of PI (with SiC whisker, SiC particle, AlN particle, and diamond particle) is proposed to satisfy the requirement of higher thermal conductivity for the high density package system. The thermal conductivity of the proposed hybrid materials with a moderate amount of doping can be improved to about 6–12 times. The hybrid films are fabricated by mechanical ball-milling process, high...
Nowadays a large number of researches have been focused on properties of epoxy based nanocomposites with an intention to create materials with enhanced properties. Literature review shows space charge behavior in dielectric materials will strongly affect the electrical performance and presence of moisture will influence space charge characteristics. In the present work, owing to the well-known water...
In the present paper, DC current of polyethylene nanocomposites containing different nanosilica loading ratios, either the untreated or the surface treated using the trimethoxy(propyl)silane coupling agent has been investigated. TGA was used to identify the true loading concentration in the samples and the nanofillers dispersion was studied using SEM. A range of electric field from 10 kV/mm to 50...
Heating of silicon substrates featuring different resistivity values by microwave annealing is investigated. The absorption of microwave energy for silicon wafers is found to be consistent with ohmic conduction loss theory. The strongest absorption occurs when the resistivity was around 10 Ω·cm. As the carrier concentration and the conductivity of silicon increase with temperature, the absorption...
In this paper, hydrothermal treatment is applied for graphene oxide (GO) reduction. Tunable work function of hydrothermal treated GO (HTGO) is facilitated by controlling hydrothermal temperature and duration time, in comparison, CVD grew graphene (CVD-G) are also prepared. Work function of GO is tuned in the range of 5.72 eV to 4.43 eV. Progressing descend of peak intensity at higher binding energy...
The temporal evolution and morphology of three-dimensional (3-D) grain growth in Cu interconnect are simulated by phase-field model techniques. In the simulation, a new local free energy density function is proposed in which the field variables can be reduced from 200 to 20. By restraining the grain orientations in the side face of interconnect, the model is applicable to simulating the microstructure...
130 wet deposition events were observed at the summit of Mt. Tai (East China, 1534 a.s.l) in China during Jan. 2005 to Dec. 2008. Zn, Al, Mn, Fe, Pb, Cu, Ni, Cr, As, and Cd were determined by ICP-MS to evaluate the characteristics of heavy metals in wet deposition at Mt. Tai region. The concentrations of these metals are generally higher at Mt. Tai than the concentrations observed at other monitoring...
A charge based compact model with self-heating effects has been developed for LDMOS transistors. Both the channel and drift regions in LDMOS are modeled without adding an internal drain node. An efficient scheme for including self-heating effects is implemented in the model, which requires no thermal network. A comparison with measured data from an LDMOS shows that the model has excellent accuracy...
The copper interconnect comes into nanometers with the scaling down of device dimension. At the same time, the resistivity is increasing and the characteristic gets worse. In our paper, an optimal aspect ratio (AR) for Cu-line is found by Monte-Carlo (MC) method so that we can get the optimized electric conductivity and improve the performance of interconnection.
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