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Multiwalled carbon nanotubes (MWCNTs) and graphite nanoplates were functionalized by chemical methods. The functionalized chemical structures were characterized by Fourier-Transform Infrared (FTIR). It is found that carboxyl groups were grafted onto MWCNTs and graphite nanoplates surfaces. Epoxy and cyanate ester polymer composites with functionalized MWCNTs and graphite nano plates were prepared,...
Anisotropic conductive adhesives (ACAs) have been considered as one of promising interconnect materials for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA joints have been a bottleneck to deploy ACAs in high power devices. In this study, we introduced conjugated dithiols into ACA formulations to construct the molecular wire junction...
In order to enhance thermal conductivity of underfill materials, hexagonal boron nitride (h-BN) was employed as a thermally conductive filler. The relationship between the filler morphology and its effects on the thermal conductivity is focused in this study. Two different h-BN fillers with different morphologies were applied to generate an efficient thermal transport path through the filler and epoxy...
SiC particles and epoxy resin were applied to prepare a potential high thermal conductivity underfill material. SiC particles are thermally coated with a nano layer silica by oxidation at high temperature. Then silane was used as the surface treatment of the silica coated SiC particles to improve the interaction between filler and polymer matrix. TEM and TGA measurements were used to characterize...
Novel nonconductive adhesives/films (NCAs/NCFs) with carbon nanotubes (CNTs) for high performance interconnects were developed. A small amount of CNTs (0.03 wt%) was dispersed into the NCAs/NCFs to increase the thermal conductivities and at the same time to decrease the coefficient of thermal expansion (CTE) for high thermo-mechanical reliability of the NCAs/NCFs interconnect joints. The thermal mechanical...
Considerable attention has been devoted to the synthesis and application of nanoparticles because of their unusual physical and chemical properties resulted from the ultra-fine size and ultra-large surface area. Polymer composite materials based on metal nanoparticles provide a potential solution to meet the present and future technological demand in virtue of the good processibility and mechanical...
In-situ polymerization of aniline salt within epoxy matrices with various content of polyaniline (PANI) was successfully carried out to prepare PANI/epoxy composites. A flexible PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss less than 0.5 at room temperature and 10 kHz. The influence of PANI loading levels on various properties was...
In this study, we have developed high dielectric constant (k>50) embedded capacitor dielectrics with a moderate volume fraction of tiller that show good adhesion, good thermal stress reliability and good large area processibility at low processing temperature (<200degC). Material design and processing are critical to obtain a high dielectric constant composite at a moderate filler loading. The...
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