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Through silicon vias (TSV) are the enablingcomponents in the emerging 2.5D and 3D integrationmicroelectronic packaging. The insulation layer, i.e. the liner, plays the key role in determining the performance of TSV. Polymer liner are receiving a growing attention for its moresuitable properties and simpler processing compared to thetradition silicon dioxide (SiO2) liner. Recently we reported anovel...
One promising application of CNTs in microelectronics is to use vertically aligned CNT (VACNT) arrays as novel thermal interface materials (TIMs). No doubt that the vertical alignment makes the best of the extremely high longitudinal thermal conductivity of individual CNTs; however, it is the CNT/substrate interface that exerts the main restriction on phonon transport through a TIM layer. There are...
A low temperature process for transferring carbon nanotube (CNT) film from a silicon wafer to a copper surface via conductive adhesives is proposed. Both the close-and open-ended CNT films were successfully transferred to a desirable substrate. The morphologies and electrical properties of the transferred CNT films were studied. An ohmic contact was formed between a CNT film and a highly conductive...
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