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One critical obstacle to preparing highly reliable isotropically conductive adhesives (ICAs) filled with Ag-coated Cu flakes is the oxidation and corrosion of Ag-coated Cu fillers, which cause the degradation of electrical properties of the ICAs at elevated temperatures and relative humidity (RH) during long-term reliability tests. Various organic compounds could be used for corrosion prevention of...
One promising application of CNTs in microelectronics is to use vertically aligned CNT (VACNT) arrays as novel thermal interface materials (TIMs). No doubt that the vertical alignment makes the best of the extremely high longitudinal thermal conductivity of individual CNTs; however, it is the CNT/substrate interface that exerts the main restriction on phonon transport through a TIM layer. There are...
In order to enhance thermal conductivity of underfill materials, hexagonal boron nitride (h-BN) was employed as a thermally conductive filler. The relationship between the filler morphology and its effects on the thermal conductivity is focused in this study. Two different h-BN fillers with different morphologies were applied to generate an efficient thermal transport path through the filler and epoxy...
This paper describes a novel manufacturing process and packaging applications of electrically conductive adhesives (ECAs) incorporated with copper (Cu) powders as electrically conductive fillers for environmentally friendly, low cost, high current capability/low contact resistance and improved reliability. Especially, we have studied isotropic conductive adhesives (ICAs) and anisotropic conductive...
Electrically conductive adhesives (ECAs) are a promising alternative for lead-containing solders in electronic packaging. However, the conductivity of ECA is lower than that of solders due to the physical contact between conductive fillers and insulative organic lubricants on Ag flakes. In this study, a group of reducing agents were introduced into a typical ECA formulation. During the curing process,...
Electrically conductive adhesive (ECA) is an alternative for the toxic lead-based solders. However, unstable electrical conductivity has long been a haunting problem. Galvanic corrosion at the ECA/pad interface has recently been found to be the major mechanism for this decay. Applying a more active metal or alloy on a dissimilar metal couple in contact can prohibit galvanic corrosion. In this study,...
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