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In this paper, results of experiments and FE simulations on mechanical issues of poly-and single crystalline silicon on ultra-thin polyimide substrates are presented. Formation and propagation of cracks within the silicon and dielectric layers are then studied under controlled bending and tensile tests using bending and tensile tools being custom designed for this purpose. The results show that the...
Initial studies have demonstrated that specially designed and fabricated microelectronics embedded in flexible substrates can maintain functionality when subjected to stretching as well as bending. The acceptable flexibility and stretchability for ultra-thin substrate could be reached by embedding the ultra-thin substrate into flexible polyimide and patterning the silicon into square or hexagon segmentations...
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