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High-speed laser plating (HLP) of gold nanoparticles on a nickel-electroplated copper leadframe has been developed. Dot patterns with a diameter of around 100 µm are formed using an inkjet printer on the substrate, being locally heated with a near-infrared laser in air for a short-time irradiation of less than 1 s. The resulting HLP gold film with a thickness of about 0.3 µm has a bulky structure...
This paper describes the characteristics of the laser welding of thin-sheet magnesium alloys using silver (Ag) nanoparticles as an insert material. The experiment was conducted using nanoparticles with 5nm and 100nm diameters that were welded with a Nd:YAG laser. The microstructure and mechanical properties of the specimens welded using inserts with different sizes of nanoparticles and without an...
The purpose of this study is to develop a dry process for minute wiring or interconnections without any wet process such as chemical etching and electroplating. The process is based on the use of metal nanoparticles and their metallization by laser sintering, which will bring a desktop manufacturing of electronic circuits in view. The present paper investigates the influence of wavelength on laser...
A novel coating technology by means of sintering the silver NanoPastereg by a laser beam has been proposed. The novelty lies in the use of a conventional NdYAG laser to metalize nanoparticles as an alternative to furnace sintering. Silver nanoparticles with 5 nm in average diameter dispersed in the the silver NanoPaste are successfully sintered on the Cu substrate by the proposed method. Laser sintering...
In order to establish technology of packaging electronic modules, we investigated conditions for laser sintering of Ag nanoparticles, and evaluated characteristics of the sintered film. First, we plotted minute patterns on a copper substrate by ink-jet printing, and then employed an NdYAG laser to metalize the nanopaste in a short time. The Ag nanoparticles (5 nm in average diameter) dispersed in...
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