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In this paper we present the finite element modelling and analysis of the wirebond structure and sintered silver joint structure of power electronic module in reliability based design optimisation context. The emphasis is on the optimal design for reliability based on computational approach that composed of high fidelity analysis, surrogate modelling, and reliability based optimisation. In particular,...
Power electronic modules (PEMs) are widely used in aerospace and automotive applications where high reliability is essential. Solder joint fatigue is one of the major failure mechanisms in PEMs, a reliability assessment method for this failure mechanism is presented in this paper. Differing from the traditional reliability prediction methods, this approach allows the reliability performance of PEMs...
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a...
The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al, consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of...
This paper describes a prognostic method which combines the physics of failure models with probability reasoning algorithm. The measured real time data (temperature vs. time) was used as the loading profile for the PoF simulations. The response surface equation of the accumulated plastic strain in the solder interconnect in terms of two variables (average temperature, and temperature amplitude) was...
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