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3D printing, also known as additive manufacturing, has been considered as the next big thing that can potentially spread as cell phone industry. Nowadays, product resolution restricted by material and fabrication process is ranging from 20 to 300 pm and still has the trends toward higher precision. However, tradeoff between time costs and resolution is always a dilemma in Fused Deposition Modeling...
In this work we reported a new methodology for ink coating for TEM sample preparation. Detailed pre-FIB and FIB processes were performed under different conditions such as method of coating used and baking temperatures. TEM profile was taken on all prepared sample to understand the critical dimensions of PR under various conditions, and a comparison was made to conclude the best coating method to...
Place a Die breaking strength is related to the surface morphology of the die. Existing of the defects on the die backside makes die fracture becomes a more severe problem in the microelectronic package. In this study, impact of the die backside defects on the stress is investigated by mechanical theories. Finite element method and 3 point bending test are used to verify the theory prediction. Thin...
The ability to improve the mechanical properties of a microelectronic package, including reducing the thermal-mechanical stress and increasing the die breaking strength is a long-sought goal in electrical assembly and packaging technology. Failure modes related with die backside stress caused by warpage or cosmetic defects may occur without a well control of die-backside stress. In this study, the...
Light weight, flexible, radiation hardened solar cells coatings are of interest for applications on satellite power generation owing to the potential advantages in terms of having higher specific power (lightweight), lower specific volume (flexible), and higher end-of-life power (superior radiation resistance), as compared to current state-of-the-art Ce-doped micro sheet solar cell coverglass. The...
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