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The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot...
An urgent need for improved thermal management of microelectronic systems has emerged as a direct consequence of increasing integration densities, both at chip and packaging level. Current thermal interface materials have been identified as a major bottleneck, hindering reduction of junction to ambient thermal resistance to future required levels (< 0.2 KW-1). In this paper we introduce and characterize...
Continued miniaturization in combination with increased performance of microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability of systems and devices. Development of advanced thermal interface materials has been identified as crucial, absorbing a portion of the advancements necessary within packaging technology. In this paper we introduce...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
This work aims to develop an anisotropic conductive adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment...
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