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An ultra-low-energy, high-dose, B-based implant was inserted after source/drain formation and before metal silicide contact deposition for PMOS devices. B beam-line implant and plasma doping (PLAD) using either B2H6 or BF3 gases were utilized for this implant process. The resulting PMOS device performance showed significant improvements, including ∼70 percent lower contact resistances, similar threshold...
Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines...
Thermal interface materials (TIMs), including thermal conductive adhesives (TCAs), grease, phase change materials (PCMs) and thermal pads, are widely used in thermal management for electronics system. In this work, a bimodal thermal conductive adhesive (b-TCA) composed of epoxy matrix and silver fillers were developed. The silver fillers consist of silver flakes and silver particles. The specimens...
This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon...
Heat resistant conductive adhesives composed of a multi-functional epoxy matrix containing Ag flakes were developed in this work. The adhesives are potentially stable up to 200-250degC because the primary relaxation mechanism of the matrix resin occurs at ~250degC. However, the adhesives appeared to exhibit another relaxation mechanism at an intermediate temperature range (100-180degC) when a mono-epoxide...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
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