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The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it can result in failure of microelectronics components. A critical issue is the removal of this heat generated. We report here a new type of nano thermal interface material (Nano-TIM) using the electrospinning...
Nanoparticles of Sn-4.0Ag-0.5Cu and Sn-0.4Co-0.7Cu (wt% composition) lead free solder alloys were manufactured and characterized for potential applications in microelectronics packaging. Scanning electron microscopy (SEM) analysis was carried out in order to study the morphology and size distribution of the nanoparticles. It was observed that nanoparticles of lead free alloys were almost spherical...
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