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The thermal problem of 3D NoC system becomes severer than 2D NoC systems due to the different heat dissipation capability between each stacking die, which increases the power density and worsen the thermal issue. Hence, many Dynamic Temperature Managements (DTMs) are proposed to control the system temperature. The DTM is classified into temporal approaches and spatial ones by considering either only...
This paper presents a precision bandgap reference with an innovative adjusted-temperature-curvature compensation circuit that obtains a good temperature coefficient (TC) over a wide temperature range. The proposed compensation circuit for enhancing the voltage accuracy of the bandgap reference combines an addition circuit, subtraction circuit, and current mirror to achieve an adjusted piecewise linear...
The distribution of traffic and temperature in a highperformance three dimensional Network-on-Chip (3D NoC) system become more unbalanced because of chip stacking and applied minimal routing algorithms. To regulate the temperature under a certain thermal limit, the overheated nodes are usually throttled by run-time thermal management (RTM). Therefore, the network topology becomes a Non-Stationary...
To investigate the thermomigration issue in flip-chip solder bumps, eutectic SnPb solder joints with typical dimensions were adopted. To observe the temperature distribution in solder joint during current stressing, infrared microscopy was employed. The bumps were powered by a desired current. Then temperature measurement was performed to record the temperature distribution (map) at the steady state...
Recently, the dimensions of the flip-chip solder bumps reduce to about 20-30 micrometers, also known as "micro-bumps" sandwitched between two Si chips. In such a structure, electromigration and thermomigration behaviors in the micro-bumps are not clear now. In this study, the temperature map distribution of Al traces and Al pads in CoC and C4 structures during current stressing was directly...
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temperature distribution in solder bump of micro bump is nearly uniform. In addition, the hot side is near the substrate side, whereas the cold side is near...
The Joule heating effect at various stages under electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 A at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump...
Flip-chip solder joints have become the most important technology for high-density packaging in the microelectronic industry. As the size of the joints progressively shrinks, the carried current density increases. The octagonal passivation opening is now used in packaging industry. The shape effect of passivation opening on its electric behavior during electromigration is clear. This study investigates...
In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we...
The Joule heating effect at various stages of electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 Amp at 100??C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump...
Several simulation studies reported that a hot spot exists in flip-chip solder bumps under accelerated electromigration. Yet, there are no experimental data to verify it. In this paper, the temperature distribution during electromigration in flip-chip SnAg3.5 solder bumps is directly inspected using infrared microscopy. Two clear hot spots are observed in the bump. One is located at the region with...
In this paper, the temperature distribution during electromigration in flip-chip SnAg3.5 solder bumps is directly examined using infrared microscopy. Two clear hot spots are observed in the bump. One is located at the region with peak current density, and the other one is at the bump edge under the current-feeding metallization on the chip side. Under a current stress of 1.06 times 104 A/cm2, the...
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