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Learners regularly abandon online coding tutorials when they get bored or frustrated, but there are few techniques for anticipating this abandonment to intervene. In this paper, we examine the feasibility of predicting abandonment with machine-learned classifiers. Using interaction logs from an online programming game, we extracted a collection of features that are potentially related to learner abandonment...
Motivated by understanding the ESD-induced currents from body-worn, wire and hose connected medical equipment is exposed to, a computer simulation is presented to estimate the impedance of a human body relative to ground. This 3D model is the basis for transient field calculation. A Method of Moments (MoM) frequency domain solution is transformed into time domain via IFFT for further circuit level...
An angiosome is a three dimensional volume of biological tissue which a specific artery governs. Although proven useful for vascular surgery, the direct relationship between arterial flow and microcirculation in specific angiosome remains controversial. Here, we present new optical approach, a four-channel diffuse speckle contrast analysis (DSCA) which can simultaneously measure blood perfusion at...
In this paper, an inverse model for applications in sea ice parameter estimation is investigated. The algorithm utilizes a forward model based on Radiative Transfer theory and Dense Medium and Amplitude Correction Theory (DMPACT), together with a global optimizer known as Simulated Annealing. The purpose of the forward model is to calculate the radar backscatter data from a set of input parameters...
An accurate bladder volume monitoring system is a critical component in diagnosis and treatment of urological disorders. Here, we report an implantable bladder volume sensor with a multi-level resistor ladder which estimates the bladder volume through discrete resistance values. Discretization allows the sensor output to be resilient to the long-term drift, hysteresis, and degradation of the sensor...
The Fermi level of graphene in contact with the metal contact is a critically important factor for graphene-based device design. Fermi level pinning like behavior at the metal on a graphene can limit the contact resistance reduction and other device operations, especially in high workfunction metal cases. We report that this problem can be substantially alleviated by the hydrogen anneal at high pressure...
Q-Band receiver and transmitter beamformer channels using 250 nm InP HBTs and 130 nm Si CMOS have been fabricated in a three-dimensional wafer-stacking platform. Room-temperature face-to-face wafer bonding is accomplished using a hybrid bonding technique (Direct Bond Interconnect®) of 2.5 micron wide, 5 micron pitch copper inlaid in silicon dioxide to form electrically active vertical interconnects...
Optical vortices, carrying a doughnut-shaped spatial form and an orbital angular momentum assigned with topological charge), have received attention in diverse application fields, for instance, high spatial resolution microscopies, quantum communications, and chiral materials processing. The aforementioned applications require highly pulsed optical vortex sources with wavelength versatility. In general,...
Ge n- and p-FinFETs with different interfacial layer ferroelectric HfZrOx (IL-FE-HZO) gate stacks have been demonstrated systematically by various annealing conditions for the first time. Microwave annealing (MWA) not only shows enhanced FE characteristics but also suppresses the gate leakage and Ge interdiffusion compared with conventional rapid thermal annealing (RTA). While HZO on Al2O3 IL results...
Workflow is an important way to mashup reusable software services to create value-added data analytics services. Workflow provenance is core to understand how services and workflows behaved in the past, which knowledge can be used to provide a better recommendation. Existing workflow provenance management systems handle various types of provenance separately. A typical data science exploration scenario,...
For beyond 7 nm node BEOL, line resistance (R) is assessed among four metallization schemes: Ru; Co; Cu with TaN/Ru barrier, and Cu with through-cobalt self-forming barrier (tCoSFB) [1]. Line-R vs. linewidth of Cu fine wires with TaN/Ru barrier crosses over with barrier-less Ru and Co wires for beyond-7 nm node dimensions, whereas Cu with tCoSFB remains competitive, with the lowest line R for 7 nm...
We developed a highly sensitive biosensor platform based on electrochemical-enzymatic redox cycling induced by selective enzyme immobilization on carbon interdigitated array (IDA) nanoelectrodes decorated with gold nanoparticles (AuNPs). The sensor platform fabricated using a simple, cost-effective, reproducible, and batch microfabrication process known as carbon-MEMS and electrodeposition. The 3D...
Service (API) discovery and recommendation is key to the wide spread of service oriented architecture and service oriented software engineering. Service recommendation typically relies on service linkage prediction calculated by the semantic distances (or similarities) among services based on their collection of inherent attributes. Given a specific context (mashup goal), however, different attributes...
7nm CMOS FinFET technology featuring EUV lithography, 4th gen. dual Fin and 2nd gen. multi-eWF gate stack is presented, providing 20% faster speed or consuming 35% less total power over 10nm technology [1]. EUV lithography, fully applied to MOL contacts and minimum-pitched metal/via interconnects, can reduce >25% mask steps with higher fidelity and smaller CD variation. AVT of 6T HD SRAM cell are...
We reported the first hybrid Ill-V/Si integrated QPSK wavelength-tunable transmitter based on high-speed ring modulators (BW∼23GHz). 80 Gbit/s PDM-QPSK signal transmission over 100 km with said integrated hybrid transmitter as well as a fully packaged silicon-based coherent receiver is demonstrated.
We review recent advances on hybrid III-V/Silicon devices using edge coupling. Design of external silicon cavities enables the realization of a broad range of on-chip functionalities as well as advanced hybrid transmitters.
The RC delay, electro migration (EM) and TDDB performance become more challenges to meet device requirement as continuous geometry shrink on BEOL dual damascene interconnects. To overcome these challenges from interconnect patterning point of view, we proposed Cu subtractive RIE as a potential solution for next generation Cu/Low-k interconnects.
This paper demonstrates the first reliable and low cost airgap BEOL technology, generated at extremely tight dimensions (48 nm pitch) in Cu/ULK. This provides 20% nested-line capacitance reduction relative to the ungapped Cu/ULK baseline. This result is of critical importance, as it validates that airgaps can be extended down to ultrafine wire levels, such as for the 10 nm technology node. Current...
The electromagnetic interference (EMI) between the devices and circuits has been widely studied for the noise absorption and the electromagnetic interference suppression of modern electronic devices.
The unidirectional propagation of signals is the key to modern electronic logic circuits and fundamental applications such as a diode, isolator, gyrator, and circulator.
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