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This study mainly focuses on the development of an adaptive control scheme for a single-stage boost inverter. First, the dynamic model of a single-stage boost inverter is analyzed and built for the later control manipulation. Then, an adaptive control scheme is designed. The effectiveness of the proposed adaptive control scheme is verified by experimental results of a 1kW single-stage boost inverter...
For RF devices, TSV contributes not only inductance but also cross-talk or interference to functional blocks. Careful designs, which take into account the TSV impact in a 3D manner, are required for fast prototyping. In this paper, typical functional circuits (inductors, LPF, BPF) are used to investigate the impact from TSV structures. Samples are made and measured using wafer-probing method. All...
Pass-band insertion loss in low-pass filters implemented in monolithic technologies is mainly limited by the Q of the inductor coils. Furthermore, the size and cost are dominated by the coils. For these reasons, most circuits used in filters of this type are of low order with a minimum number of coils. This paper describes a low pass filter using a bridged-tee architecture to implement a 5th order...
The drive for small form factor and foot print area packages is being fueled by consumer electronic applications that today constitute 50% of semiconductor revenue. Mobile phones are experiencing explosive growth both in terms of unit shipments and increased complexity at the same time. In just one decade mobile phone has transformed from a simple communication device into more complex system integrating...
The demand for wireless communications is increasing through use of smart phones, 3G handsets wherein high speed and reliable data communication are crucial requirements. Multi-bands networks help to facilitate these at higher range of radio frequencies. In many wireless communications, power amplifiers (PA) are used to increase the amplitude of relatively weak signals. These PAs depend on matching...
This paper proposes a third-order bandpass filter using low temperature co-fired ceramic (LTCC) technology. The filter employs two grounding inductors, connecting the two parallel LC resonators, to provide a transmission zero in the upper stopband. A feedback capacitor between input and output is also used to generate two transmission zeros. With the help of stepped-impedance resonators (SIR's), the...
We have investigated the impact of die thickness on integrated passive device (IPD) performance both in simulation and from measurement for RF stack-die applications. Our simulation approach accurately predicts the behavior of the IPD in such stack-die configuration. This should help us to generate guidelines for RF integrated passive devices to be used in 3D stack-die packages.
Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. WLP is the upcoming future packaging technology. The driving factors for the implementation of this packaging technology are the low packaging and test cost, the excellent electrical and thermal...
In this paper, inductors embedded in a mold material are characterized. Due to the low-loss property of the mold material, plated Cu inductors show high quality-factor (Q) performance. This performance is also better than those of similar inductors implemented from our IPD process. The mold material is not only used as a supporting substrate, but also served as package substrate, which allows the...
Typical directional couplers are based on quarter-wavelength transmission line segments. Such designs are physically too large for most integrated system-in-package applications. A lumped-element circuit for electrically short, narrow-band directional couplers is described and analyzed. This circuit is much smaller and is better suited for integrated assemblies. Its directivity is shown to derive...
Coupled-resonator baluns consist of a pair of LC resonators that are coupled by mutual inductance. They are usually designed using circuit optimization methods, but this optimization is highly constrained by limitations in the implementing technology and restrictions on size and cost. However, by tuning the capacitors in each resonator, acceptably good designs can be realized over a wide range of...
An integrated passive device (IPD) technology has been developed to achieve lower cost, further miniaturization and higher performance radio frequency (RF) devices for wireless communication system applications. This paper describes a compact power divider suitable for wireless system application using integrated passive device (IPD) technology based on silicon substrate. The 2-way power divider of...
A small form-factor balanced filter for WiMAX applications is developed using silicon-based IPD technology. The balanced filter (1.2 mm times 2.0 mm times 0.4 mm for flip-chip version, and 1.2 mm times 1.6 mm times 0.25 mm for wire-bonding version) is the smallest device achieving similar electrical response, to the best of our knowledge. The insertion loss at the pass-band is 2.0 dB. The attenuations...
ESD failure limits have been measured in a variety of silicon integrated passive devices using the Human Body Discharge Model. The failure mechanism for these circuits is typically the destructive breakdown of the thin insulator layer in metal-insulator-metal capacitors. The capacitors in this particular technology have a static breakdown of 70 to 100 V. Failure from ESD events for a single capacitor...
Thin-film technologies most commonly use capacitors or inductors to couple resonator stages for the implementation of band-pass filters. The use of mutual inductance (referred to as magnetically coupled, to distinguish it from conventional inductive coupling) has some inherent advantages, especially for ESD robustness and DC isolation. Furthermore, this method is naturally suited for the implementation...
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