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Simulation and physical experiments have shown that vacancy engineering implants have the potential to provide outstanding pMOS source/drain performance for several future CMOS device generations. Using vacancy-generating implants prior to boron implantation, hole concentrations approaching 1021cm-3 can be achieved using low thermal budget annealing. In this new study we propose that the vacancy engineering...
In industrial environments, technology computer-aided design is used intensively for the design and optimization of new device architectures. To maintain its usefulness for future technology nodes, process simulation has to be able to predict the activation and distribution of dopants after advanced implantation and annealing schemes. Such annealing strategies will be based either on millisecond annealing...
In this paper, we investigate the evolution of extended defects during a msec Flash anneal after a PAI implant and show that during the ultra-fast temperature ramp-up and ramp-down, the basic mechanisms that control the evolution of defects are not modified with respect to the relatively slower RTA anneals. In addition, we show that junction depths below 15 nm can be achieved using a US J fabrication...
Millisecond annealing as an equipment technology provides ultra-sharp temperature peaks which favours dopant activation but nearly eliminates dopant diffusion to form extremely shallow highly electrically-activated junctions. On arsenic beamline implanted wafers the formation of ultra-shallow junctions at peak temperatures ranging from 1275degC to 1325degC was investigated. The thermal stability of...
The diffusion length of the flash anneal is lowest for all different implant conditions. For the arsenic implant similar diffusion length is seen for all the processes that include a spike anneal due to the fact that the overall thermal budget is mainly determined by the spike anneal. Boron implants into crystalline as well as pre-amorphized silicon show similarly low sheet resistance independent...
Millisecond annealing either by flash lamp or laser appears to be the leading approach to meet the needs of ultra-shallow junction annealing and polysilicon activation for advanced technology nodes. There are many advantages to this technology including high electrical activation, excellent lateral abruptness, controlled and limited dopant diffusion and the ability to engineer the extended defects...
We investigated various p+ extension implantation dopant species (B, BF2, B10H14 & B18H 22) and annealing techniques (spike, flash, laser and SPE) to achieve high dopant activation low damage ultra-shallow junctions (USJ) 15-20 nm deep for 45 nm node applications. New USJ metrology techniques were investigated to determine: 1) surface dopant activation level and 2) junction quality (residual implant...
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