The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The formation and propagation of void in flip-chip solder joints would reduce the reliability of solder interconnects obviously. Notably, continuously scaling down of the feature size of solder joints may greatly promote the formation and propagation of void in solder joints under electric current stressing. In addition, the elastic stress field induced by the externally applied stress has a big influence...
The separation state and inhomogeneous nature of microstructure in Sn-Bi based solders can reduce the reliability of solder interconnects obviously. Notably, continuously scaling down of the feature size of solder interconnects may greatly promote the electromigation and segregation of Bi atoms in Cu/Sn-Bi/Cu interconnects under electric current stressing, which will induce the inhomogeneity of the...
The migration and segregation of Bi atoms in Cu/Sn-Bi/Cu solder interconnects under electric current stressing usually induce the formation of Bi-riched layers at the anode side, which can cause the failure of solder interconnects easily. In our study, the microstructure evolution of the eutectic Sn-Bi solder in a Cu/Sn-Bi/Cu flip chip solder joint and a right-angle Cu/Sn-Bi/Cu solder interconnect...
Dimension of solder interconnects (or joints) and pitches has been continuously scaling down, resulting in inhomogeneous microstructure and severe electromigration (EM) effect in solder interconnects. In this study, the interaction effect between electromigration and microstructure evolution in ball grid array (BGA) structure Cu/Sn-58Bi/Cu solder interconnects under a direct current density of 1.5×10...
Dimension of solder interconnects (or joints) and pitches has been continuously scaling down, resulting in inhomogeneous microstructure and severe electromigration (EM) effect in solder interconnects. In this study, the interaction effect between electromigration and microstructure evolution in ball grid array (BGA) structure Cu/Sn-58Bi/Cu solder interconnects under a direct current density of 1.5×10...
The interaction effect between electromigration (EM) and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect with asymmetric configuration along current direction was studied by cellular automaton (CA) modeling embedded with finite element (FE) simulation, with a comparison to in-situ scanning electron microscope (SEM) observation and focus ion beam (FIB) microanalysis. The CA method was...
The influence of the pre-existing void in the Cu/Sn-58Bi/Cu solder joint on electromigration behavior was investigated by in-situ SEM observation and focused ion beam (FIB) analysis. The results show that the void with smooth internal surface has no influence on the Bi atom migration, while the one with a sharp notch may easily result in Bi atom congregation and further lead to the formation of cracks...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.