The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A three-dimensional system-in-package (3-D SiP) based on silicon carriers or an interposer is a fast-emerging technology that offers system design flexibility and the integration of heterogeneous technologies. A passive interposer, which is a way to bridge the feature gap between the integrated circuit (IC) and the package substrate, is a key building block for high performance 3-D systems. The need...
In order to fabricate flexible microelectronic devices, fabrication of metallization lines and metal electrodes on the flexible substrate is essential. For minimizing the size of device, the realization of metallization lines with the scale of a few micrometers on the flexible substrate is very important. In this study, pulse electroplating has been applied in order to metalize PI surfaces with Cu...
The use of lasers in the field of microelectronics is growing and diversifying as designers look to innovative technologies to enable the ever-increasing sophistication of their products. Lasers are employed in manufacturing processes as varied as semiconductor lithography, wafer dicing, micro-welding and via drilling. The primary driver for the use of laser technology is the relentless progression...
Failures like short circuit are always encountered in PCBs (printed circuit boards) due to defects in the flexible interconnection. In this paper, systematic analysis such as macro and micro observation was carried out on shorting trace in Polyimides (PI) films used for flexible substrates interconnection (FSI) packaging applications. The thin flexible PI films have desirable properties for use in...
In this paper, the growth mechanism of intermetallic compound (IMC) layer between Copper (Cu) free air ball (FAB) and Aluminum (Al) bond pad is carefully examined. The test vehicle is pd-coated Cu wirebonds on Al pad in plastic ball grid array (PBGA) package. Palladium (Pd), the anti-oxide material coated on Cu wire will be blended in the Cu FAB when the ball is formed by an electrical flame-off (EFO)...
The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are conducted in the present paper. In the first, the characteristic of heat affected zone (HAZ) and free air ball (FAB) on thin Copper (Cu) wire have been carefully experimental measured. Thin film interfacial micro-tribology behavior between Cu FAB and Al pad is examined by Atomic...
The aim of present research is to investigate the characteristic of ultra thin copper wire and aluminum pad. In the first, the electric flame-off (EFO) characteristic of ultra thin copper wire has been carefully examined. Experimental results show thermal aging effect has significantly influence on the micro structure of free air ball (FAB). Optical microscopic (OM) examination for an as-drawn copper...
In order to improve quality of teaching and method of teaching and learning process, flexible strategy is introduced into e-learning - flexible teaching model is created. This model includes flexible teaching and learning idea, teaching strategy, flexible management and flexible organization. The model provides new learning method such as peer exchange for learners to change their learning strategy...
Wine-processing waste sludge (WPWS) has been shown to have powerful potential for sorption of some heavy metals (i.e., chromium, lead and nickel) in single-component aqueous solutions. But although most industrial wastewater contains two or more toxic metals, there are few sorption studies on multicomponent metals by WPWS. This study has two goals: (i) conduct competitive adsorption using Cr, Cu and...
A comprehensive integrated electro-thermo coupling model is developed to investigate the electro-thermo-mechanical effects and electromigration analysis on Package-on-Package (POP) in this paper. POP packaging involves in ultra thin gold wire (??=1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in the Copper trace...
This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
In the present paper, the characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer during wire bonding process has been predicted by using finite element method. Material property for Cu wire from mechanical tensile test has shown much more rigid than Au wire...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also carefully investigated. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical...
BGA socket is most important part in the final testing which selects the good or bad chip of BGA packages. When testing BGA-type packages using a BGA socket, the characteristic contact conditions and mechanisms of surface degradation in a low and stable contact are essential. However, the electrical contact between the pogo pin and the solder ball of the BGA-type package becomes unstable following...
CMOS chips are scaled to smaller geometries, the interconnects play an increasing role in the overall chip performance. This paper presents an integrated process for yield enhancement strategy to overcome a so-called "cosmetic defects" in 130- and 90-nm complementary metal-oxide-semiconductor (CMOS) process node.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.