The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents the development of a laser assisted polymer bonding process using benzocyclobutene (BCB) for encapsulation of MEMS and other microscale sensor devices. The polymer rings were fabricated on capping substrates using the photosensitive BCB resin and photolithography and then bonded onto device substrates to form microcavities for MEMS packaging. A high-power fibre-coupled diode laser...
This paper presents chip scale investigation of polymer based bonding processes for producing microcavities for encapsulation of MEMS and other microscale devices. The polymer sealing rings were fabricated on the glass covers using the photosensitive BCB polymer and photolithography. They were bonded onto a variety of substrates including silicon substrates, aluminum coated substrates and glass substrates...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.