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We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial...
Asymmetric transmission or optical-diode behavior have very important applications in information technology, such as directionally-sensitive beam splitting, multiplexing, and optical interconnection. Here, we propose an all-dielectric chiral metamaterial to realize asymmetric wave transmission in far-infrared band. Made of Si-based double L-shaped resonators on both sides of SiO2 substrate, the three-layered...
A novel method of reconfigurable substrate integrated waveguide (SIW) antenna is proposed. By loading ferrite slabs and applying DC magnetic bias, we realize the reconfiguration of operating frequency and polarization of the SIW antenna. The experiments demonstrate the reconfigurable SIW antenna could have broadband frequency tunable range which is up to 14.9% in microwave X-band, and the radiation...
This paper introduces a novel air-dielectric via structure which can improve the interconnect signal bandwidth by reducing the impedance mismatch in vias of high speed system PCBs carrying 20 Gbps+ signals. Design methods of the proposed air-dielectric structure are presented. Using these methods a system target design impedance can be better matched thus causing reductions in the signal degradation...
This paper describes the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration). Each device is housed in a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. Inside the package, a heterogeneous IC stack delivers up to 2.78Tb/s transceiver bandwidth. The resulting bandwidth is approximately three times that achievable in a monolithic...
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