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Organic based materials and devices for flexible electronics have many disadvantages such as low charge transport, process temperature limitation, and etc. Those limitations, based on material itself, make the flexible electronic device difficult to compete with Si-based hard electronics that have excellent electric properties and much advanced design rule. Thus, as an effort to overcome the known...
Low cost and high speed molten solder-filling process of through silicon via (TSV) for 3D packaging was investigated. Present filling methods, such as Cu electroplating and chemical vapor deposition (CVD), have some problems like low process speed and complicated process factors. In this study, molten solder was filled into the TSV without voids by using vacuum system. The thickness of wafer was 200...
This study investigated the reaction and mechanical properties of a In added quaternary composition solder alloy having low Ag content, i.e. Sn-xAg-0.5Cu-yIn to replace the Sn-3.0Ag-0.5Cu composition used widely as a representative Pb-free solder alloy. We found that the In addition of small amount did significantly improve a wettability of the solder at the reflow temperature of 230~240degC. Moreover,...
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