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This paper presents the 2-D numerical simulation results of the single-event burnout (SEB) in the floating field ring (FFR) termination of a power MOSFET for the first time. We investigate the SEB triggering mechanism and SEB performance based on a 140-V typical FFR termination, and find that the structure is sensitive to SEB because of a sharp temperature rise appearing at the p+ base/n-drift junction...
This paper describes a low temperature drift Z-axis silicon gyroscope with a low temperature sensitivity interface circuit. The gyroscope's temperature drift is optimized from two aspects: MEMS structure and its interface circuit design. Firstly, the sources of zero rate output(ZRO) are analyzed, and then we point out that improving the stability of demodulation phase can reduce thermal drift effectively...
The paper reports on the development and characterization of an innovative all-optical laser delivery fibre probe for cancer cell ablation with simultaneous temperature sensing capabilities. The probe integrates a grating-based temperature sensor and a laser delivery fibre whose tip surface is micro-structured for adapting the beam diffusion to the tumour geometry. Different temperature sensor configurations...
As the integration density rockets up for contemporary VLSI circuits, power consumption limits the scalability of technology advancement of CMOS. Spin transfer torque-magnetic random access memory (STT-MRAM), as one of the emerging non-CMOS technologies, has the promising prospect of low standby power, fast access speed and compatibility with the CMOS fabrication process. However, with the technology...
Evaporative cooling with watery pad and exhaust fan has been broadly studied in past years. Although such cooling system has been demonstrated for higher energy saving than traditional air conditioning machines, it also innately inherits drawback of temperature gradient along airflow direction. In this paper, we will practically survey the performance of our evaporative cooling system. According to...
Nowadays production improvement of orchids in flower nursery is relying on intelligent environmental management. Such objective can be realized by cooperating with automation controls, computer science, and sensing technologies. In this paper, we introduce our orchid nursing system involving sensors' alignment processes. Here an enclosed mobile nursery is equipped with a low-cost embedded system for...
As a temperature sensor, the fiber gratings get a rapid development with its own advantages. We have done some experiments to test the temperature response characteristic of the optical fiber grating Based on introduce the principle and the structure of the optical fiber grating temperature detection system, and the experiments verified a better fitting relationship between the optical fiber grating...
Though 3D TSV/TSI technology provides the promising platform for heterogeneous system integration with design drivers ranged from thousand-core microprocessor to millimeter-cubic sensor, the fundamental challenge is lack of light to deal with significantly increased design complexity. From device level, new state of variables from different physical domains such as MEMS, microfluidic and NVM devices...
In this paper we enhance our fall monitor with our recognition of the direction of fall functionality. We not only analyze the change of acceleration but also analyze five typical actions of humans: walking, running, standing up, sitting down and jumping. Then we compare these actions with the acceleration characteristics of a fall: the weightlessness, the impact, and the overturning of the body....
Stacking die technology using through-silicon-via (TSV) technology has attracted a lot of attention due to various advantages in performance and integration. However, a high temperature environment during the fabrication process of TSV leads to uncontrollable thermal expansion, which then causes a serious reliability problem, the thermal mechanical problem. This problem can result in deformation or...
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