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The design, fabrication and testing of a novel resonant accelerometer integrated with a temperature sensor is presented in this paper. The accelerometer consists of double quartz resonators and a silicon substrate. A novel diamond like carbon (DLC) film with special electrical property, excellent mechanical property and chemical stability, which has negative temperature coefficient of resistance (TCR),...
This paper reports the design and fabrication of dynamic ultra-miniature pressure sensor. Based on bulk silicon MEMS micromachining technology, the Si-Si direct vacuum bonding and thinning technology with precision control were used to fabricate the subminiature silicon piezoresistive chip for absolute pressure measurement. The sensors with outer diameter Φ2.0mm were packaged with miniature probe...
Low temperature process is important for capacitive micromachined ultrasonic transducers (CMUTs) to integrate with integrated circuits (ICs) in order to reduce parasitic capacitance and improve its device performance. This paper presents a novel low temperature fabrication technology for CMUTs. Transition metal layers (the Ti/Au layer and Ti/Sn/Au layer) were used for bonding between the silicon substrate...
We described an optical micro-electro-mechanical-system (MEMS) pressure sensor based on light intensity modulation that can be used in petrochemical and oil well area. The idea is to use light for transmission to replace electrical signals. Utilizing bulk micromachining technology of silicon, a membrane is obtained for sensing pressure and reflecting the light. The intensity of reflected light shifts...
We present a micro resonant acceleration sensor based on the frequency shift of quartz double ended tuning fork (DETF). The two stiff ends of DETF are mounted on proof mass and temperature isolator structure of silicon support, respectively. Electrodes are coated on the four surfaces of the resonant beam to excite anti-phase vibration model to balance inner stress and torque. Stress in DETF beam shifts...
This paper aims to examine the feasibility of a novel resonant pressure sensor, which is realized by introducing a double-ended tuning fork (DETF) quartz resonator into a silicon substrate. Theoretical model and finite element simulation results are given to provide support for the scheme. Sensor prototypes are fabricated based on micromachining technologies. Experimental setup for testing is established...
We present a temperature compensation system for silicon piezoresistive pressure sensor based on neural network. This system can be used for measuring the pressure of various media. And the design can simplify the implementing hardware of pressure measurement system. Compared with traditional design, it can output three signals: current signal, digital signal based on RS485 and Zigbee wireless signal,...
The paper presents a piezoresistive absolute micro-pressure sensor for altimetry. This investigation includes the design, fabrication and testing of the sensor. An improved structure is studied through incorporating sensitive beams into the bossed-diaphragm structure. By analyzing the stress distribution of sensitive elements using finite element method (FEM), the configuration shows an enhanced sensitivity...
Presented is a piezoresistive absolute micro-pressure sensor, which features relatively high sensitivity and overload resistance simultaneously. In this investigation, the design, fabrication and testing of the sensor are carried out. By analyzing the stress distribution on sensitive elements using the finite-element method (FEM), an improved structure through introduction of sensitive beams and islands...
In this paper, we describes an integrated MEMS tactile tri-axial micro-force probe sensor based on piezoresistive for Minimally Invasive Surgery (MIS) as it's micro-structure, three-dimensional measurement and high resolution up to be micronewton (μN) scale. The sensor is 4 × 4 × 20.9 mm3. The sensing element of the sensor is fabricated on Silicon on Insulator (SOI) wafer by surface and bulk micromachining...
A kind of micro piezoresistive pressure sensor with stable performances under high temperature is designed based on the silicon on insulator (SOI). Through analyzing the stress distribution of diaphragm by finite element method (FEM), the model of structure was established. The fabrication operated on SOI wafer, which can be used in extreme high temperature environments, and applied the technology...
In order to solve the pressure measurement problem in the harsh environment, such as high temperature above 200degC, a special piezoresistive pressure sensor chip has been developed. Based on the MEMS (micro electro-mechanical system) and SIMOX (separation by implantation of oxygen) technology, the piezoresistive pressure sensor chip was constituted by silicon substrate, a thin buried silicon dioxide...
In order to satisfy the different packaging requirement of individual sensors in the monolithic multi-sensor chip, a hybrid packaging method is presented in the paper. The packaging method of multi-sensor makes use of high-resolution stereolithography system of photopatternable resin constructing the main packaging structure in the way of batch production, low cost and good resolution. A monolithic...
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