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The rapid development of three dimensional packaging makes it necessary to develop smaller and more reliable microbumps. In the electrodeposition process of bump cylinder, the filling quality is largely determined by the combination of additives. In this work, the effect and competitive adsorption between suppressor polyethylene glycol (PEG) and accelerator Bis-(3-sodiumsulfopropyl disulfide) (SPS)...
In this study three-dimensional finite analysis models of 3D micro-scale chip scale package (CSP) solder joints were set up. The stress-strain distribution of micro-scale CSP solder joints was obtained by finite element analysis under the condition of random vibration load. The influence of different solder, pad diameter and solder joint volume on the stress-strain of micro-scale CSP solder joint...
For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
In this paper, the effect of reflow time on shear property of Sn-9Zn solder bumps was studied. The Sn-9Zn solder bumps were prepared by two step electroplating method. With the increase of reflow time, the shear strength decreased first and then increased. The change of shear strength was closely related to the formation of intermetallic compounds (IMCs). Scanning electron microscope (SEM) and Energy...
Silicon anodes, with an extreme high theoretical specific capacity of 4200mAh g−1 and proper stable plateau potential of 0.4V, are considered one of the most promising anode materials in rechargeable Lithium-ion batteries. However, the great structural and volumetric changes during charge/discharge cycles relating to poor cycling performance are still the most critical challenges limiting the breakthrough...
Unit warpage in Ball Grid Array (BGA) packages with different substrates due to coefficient of thermal expansion (CTE) and Young's Modulus mismatch was investigated. The effect of substrate materials on BGA packages warpage was analyzed. Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA) were used to measure Glass Transition Temperature (Tg) and CTE and Young's Modulus of the...
With the strength of fine pitch, high electrical conductivity and excellent reliability, copper pillar interconnect becomes a promising alternative to traditional solder bump. However, bad surface smoothness is a severe problem and significantly affects the reliability of the bump connection. In this paper, numerical simulations on the shape evolution of copper pillar bump and the effect of bump dimension...
As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
A high power THz free electron laser (FEL) facility is under construction at China Academy of Engineering Physics (CAEP) since October, 2011. The radiation frequency of the FEL facility will be tuned in range of 1∼3 THz and the average output power will be about 10 W. The system mainly consists of a GaAs photoemission DC gun, superconductor accelerator, the hybrid wiggler, optical cavity. In this...
A photonic-based phased array antenna (PAA) with ultra-fast beam scan is proposed and experimentally demonstrated using dispersion-based true time delay lines. The ultra-fast angle scan is realized using an ultra-fast wavelength-swept laser source which is constructed by a gated multi-wavelength laser (MWL) and a dispersion compensation fiber (DCF). The wavelength switching time is about several nanoseconds...
InAs/GaSb type-II superlattices materials have large quantum efficiency and responsivity, and smaller tunneling current and Auger recombination rate. However, the lattice constants of two components of the SLs are not exactly the same, which would introduce strain between each layer. InSb is introduced into InAs component, forming InAs1−xSbx/GaSb to free the strain. Band structure of SLs is computed...
Package warpage is often a problem in surface mount reflow process especially for thin package. Large warpage prevents package solder balls to be connected to PCB pads and results in low process yield. In order to effectively minimize warpage in reflow process, this paper proposed a new approach to reduce package warpage by temporally bonding the back of the packaged component to a rigid plate. In...
With the requirements of higher board level reliability, researchers gradually turned attention to complex composition solders like Sn-Ag-Cu-Ni-Bi solders. This quinary system solder has lower melting point and higher tensile strength than traditional Sn-Ag-Cu solder, which may good for the reliability. In this research, the effects of tensile strength on thermal fatigue properties of Sn-2Ag-0.5Cu-0...
Established embedded substrate microscale ball grid array solder three point bending stress and strain finite element analysis model, analyzed the solder joint materials, spot diameter and the influence of the bending stress and strain of solder pad diameter, the results show that the torque load, the embedded type substrate microscale BGA solder joint array of maximum stress and strain are occurred...
The measurement of semantic similarity is a fundamental task in natural language processing. In the settings of a community question answering (cQA) system, it is essentially a classification problem: given a pair of questions, label it similar, relevant, or irrelevant. Traditional methods, either those at word level or at sentence level, typically require many lexical and syntactic resources, which...
Vascular Interventional surgery (VIS) is the main method for diagnosis and treatment of endovascular diseases. However, the surgeon operates the surgery with hands in conventional VIS, which need the surgeons exposed to X-ray radiation with long time. The operation of the Vascular Interventional Surgery is long time processing, which will lead to fatigue of the doctor and the patient, and the doctor's...
The dawn of the Industrial Internet era has shed light on the value of the big data associated with many industrial areas, such as aviation, resources, and manufacturing. Although the promising industrial big data could offer competitive advantages, it also poses profound challenges to the traditional analytics methods. The exploration and visualization capabilities are falling short for the fast-growing...
This paper discussed the applications of electron energy loss spectroscopy (EELS) for element characterization in semiconductor manufacturing. The first experiment compared the ability of element chemical states analysis between EELS and X-ray photoelectron spectroscopy (XPS). Some phase change random access memory (PcRAM) product suffered TiN connection electrode failure. EELS and XPS were used separately...
In this paper, we reported a EVB Burn In (B/I) failed case of our ABCD part and led to the finding of VIA process fabrication issue with TiN film process marginal issue. This EVB B/I failed case was carried out by electrical failure analysis (EFA) and physical failure analysis (PFA) using FIB X-section and TEM. This paper also demonstrated different EFA technology, which included curve tracer analysis,...
In this paper, Focus Ion Beam (FIB) 3-point localization method and its applications in Failure Analysis (FA) were introduced. The FIB capability of material milling plays an important role in FA, but sometimes the target site of milling is invisible in FIB, making it impossible to do specific cross sections. With the help of the proposed 3-point localization method, most invisible targeted sites...
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