The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Full-bridge power-factor-correction (PFC) front-end + dual-active-bridge (DAB) AC/DC topology is widely used in industry, e.g., electrical vehicle on-board charger. Such two-stage topology limits the system efficiency, and the bulky DC link bus capacitor makes the system power density relatively low. Compared to the two-stage design, the single-stage design, unfolding bridge + DAB, eliminates the...
It is expected that wide-bandgap devices like silicon carbide MOSFETs and gallium nitride HEMTs could replace Si devices in power electronics converters to reach higher system efficiency, e.g., a 3-phase 380VAC bidirectional battery charger for electric vehicles. This paper uses the conventional half-bridge LLC topology to build a 10kW all-SiC bidirectional charger. As a well-known topology for the...
At present time, the most common electrical vehicle (EV) chargers employ a two-stage design, i.e., a front-end AC/DC stage + an isolated DC/DC converter. In this paper, an isolated dual-active-bridge (DAB) based single-stage AC/DC converter was proposed, which has the power-factor-correction (PFC) and zero-voltage-switching (ZVS) functions over the full-load range. By reducing one power stage and...
In power device package development, super high thermal performance adhesive either solder or polymeric adhesive are highly desired for better thermal resistance and RDSON. High thermal polymeric adhesive consists of high silver loading, unique thermoset resin, and solvent. Solvent evaporates during oven curing, silver flakes will be compacted to generate high thermal and electrical conductivity....
In this study, we used antibody-immobilized AlGaN/GaN high electron mobility transistors (HEMTs) for detecting a short peptide, and revealing the number of binding sites of the antibody for the peptide and the dissociation constants of the antibody-peptide complex. In our case, two binding sites were found on the ferritin heavy chain (FHC) antibody and the dissociation constants of the antibody-peptide...
In TO220 FullPAK high voltage application, matrix leadframe design increases leadframe density and provides consistent isolation thickness. Tie bars removal exposes 0.8 mm length × 0.4 mm width metal holes, filling with minimum 15 kV/mm dielectric strength insulation material is required to prevent arching. Three unique filling materials, which include an UV cure material, one part and two parts components...
Package delamination forms a separation layer in between mold compound to chip, die paddle and leads, which subsequent affects ground bond quality and degrades package electrical performance. This paper focuses on the interaction relationship of each assembly process towards lead delamination in Dual in Line (DIP) package. No ground bond delamination is allowable to ensure the package robustness....
An X-band Weaver-Hartley dual-conversion low-IF downconverter is demonstrated in this paper using 0.35-??m SiGe heterojunction bipolar transistor (HBT) technology. The first image signal is shifted away from the IF band due to the complex Weaver architecture while the second image signal is eliminated by a polyphase filter in the following Hartley architecture. In this work, a resonant LC load is...
In power management semiconductor industry, the most comprehensively used metals in microelectronic packages include copper, aluminum, nickel, gold and silver. When different metals contact to each other, intermetallic compound (IMC) will form at the interface. Under different conditions, IMC may vary to show very complicated characteristic and composition, some Moderate IMC will increase interfacial...
This paper presents the development of a mobile robot platform, That can be use in offices and commercial environments. Thus the ability of a robot to plan motions autonomously is of importance. This work gives a new intelligent control of a wheeled mobile robot motion in an unknown environment. The technique generates satisfactory real time movements of autonomous robot to reach its goal safely.
Stacked transformers, coupling stacked transformers, interleave transformers and symmetrical transformers on GaAs substrate are systematically studied in this paper. Two kinds stacked transformer are under study. One has the symmetrical electric property while the other one has a better quality factor for the primary port. The stack transformers have achieved the highest coupling coefficient (~0.9)...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.