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Ultra-thin chip technology is identified as an enabler for overcoming bottlenecks in microelectronics, such as 3D integration, and for leading to new applications, such as hybrid, flexible system-in-foil (SiF). This, however, calls for new techniques in fabricating very thin wafers or chips, in applying them to device integration processes and in assembly and packaging. The application to SiF requires...
A new ultrathin chip fabrication and assembly process, consisting of a preprocess module Chipfilm and a postprocess module Pick, Crack, and Place, is presented. In contrast to the established wafer thinning technique, the preprocessed wafer substrates are prepared with extremely narrow buried cavities beneath the chip areas at a well-defined distance from the wafer surface, thus precisely defining...
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