The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Reliability tests on packaged ultraviolet light-emitting diodes (LEDs) in the ultraviolet-C (UVC) range (< 280 nm) were performed under various temperatures and currents. At higher case temperature, a greater degradation in output power was observed over 1,000 hours. Degradation in output power was also observed at higher operating currents. Some of the output power degradation can be attributed...
Partially-insulated oxide (PIOX) layers are implemented under the source/drain region in bulk FinFETs. The improved short channel effect by controlling the sub-channel on the bottom part of the gate in bulk FinFETs, the decreased junction leakage current due to blocking the vertical leakage path by PIOX layers, and the increased hot carrier lifetime can be applicable to future DRAM cell transistors.
For the first time, we have successfully fabricated fully integrated advanced bulk FinFETs featuring partially insulating oxide layers under source/drain (S/D), named partially-insulated- FinFETs (PI-FinFETs), to control subchannel on the bottom part of the gate in bulk FinFETs and suppress punchthrough and junction leakage currents. We observed that the junction leakage is improved about 50%, drain-induced...
Non-uniform current flow after Fowler-Nordheim current stress has been discussed. In a large thin oxide area, there are certain fixed spot areas which can trap electrons easily, and Fowler-Nordheim tunnel current is reduced at the spot areas. Enlargement of the stress induced leakage current due to trapped holes could happen at all spot areas with the same probability, but the spot areas are replaced...
A new kind of stress induced low level leakage current (LLLC) in thin silicon dioxide is reported. It is observed after the stress of hot hole injection at the drain edge. Since the voltage dependence of this new kind of LLLC is steeper than that in the conventional FN stress-induced LLLC, each conduction mechanism may be different. This LLLC is reduced by both hot electron injection and UV irradiation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.