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This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
The thermal fatigue and mechanical fatigue are the two main failure modes for board level solder joint in SMT. The comparison investigation of thermal fatigue and mechanical fatigue behavior of solder joint are carried out by experimental method in this study. The surface mounted test PCB is used and two kinds of solder materials, including SAC305 and Sn37Pb, are considered. It is shown that lead-free...
The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First, ten 2D simplified models of PBGA (Plastic Ball Grid Array package) structure with different shape of solder joints, which are obtained from surface mount experiments, are established using finite element software...
Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder joints were investigated by accelerated aging experiments and finite element analysis (FEA). Results...
In electronic product, reliability of solder joint has big impact on the function of the whole electronic product. In the design period of the package, it is important to predict solder joint thermal fatigue lifetime and analyze the effect of each factors on the lifetime of solder joint. Finite Element Analysis (FEA) based solder joint lifetime prediction method, which used Anand viscoplastic constitutive...
This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8??8 mm PBGA, l0??l0 mm QFN, and 51??51 mm CBGA. They are designed to consist of SAC387, SAC305, ??SAC305 ball + SAC387 paste?? and ??SAC387 ball + SAC305...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
Deterministic approaches may predict the life of solder joint interconnects used in microelectronic devices far different from the test results and field environment. This difference is caused by uncertainties introduced in finite element and damage modeling with different random variables such as material properties, geometry, damage model constants, and many others. This paper presents a methodology...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
Most accelerated temperature cycling (ATC) tests reported the observations that SnAgCu (SAC) solders have better thermal fatigue reliability than SnPb solders due to their lower creep strain rate. But material studies revealed that this is true only when stress level is below a certain level. When the stress level in the solder increases, eventually the creep strain rate of SAC solder may outgrow...
The lifetime of an IGBT power electronics module under cyclic temperature loading conditions has been analyzed using finite element analysis method. The failure mechanisms that have been taken into account are the fatigue of the chip-mount-down solder joint, the substrate attach solder joint, the busbar solder joint and the Aluminum wirebond. The results show that the lifetime of the module is about...
Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The...
Thermal fatigue lifetime of the Fan-in Package on Package (FiPoP) was analyzed based on the plastic strain model by finite element analysis (FEA). Both the stress and strain of FBGA and PBGA solder joints were studied under thermal cycling. It was found that the outmost solder joint on the PCB was the most dangerous position. The fatigue lifetime for the key solder joint on the PCB was estimated using...
CBGA (ceramic ball grid array) is one kind of advanced package for FPGA, which can fulfill the demands of high interconnect density, high thermal and electronic performance, high chip-assembling yields, high reliability. But in multiple loading environments, CBGA has the invalidation mode of solder joint thermal-mechanical failure, which will influence the long term reliability of FPGA circuits. But...
In SMT, the investigation on solder joint's failure is always very important. Thermal fatigue is the main failure form for solder joint in SMT. In this paper the failure process of solder joint in SMT was investigated by both electrical resistance measurement method and crack observation method together. The characteristics of electrical resistance value variation of lead-tin and lead-free solder...
SnAgCu solder is fast becoming a reality in electronic manufacturing during to marketing and legislative pressure. This paper studies the thermal fatigue life of flip chip by the application of thermal fatigue life prediction model. The required life prediction model for SnAgCu solder joint is based on fatigue-creep interaction damage theory. In same test condition, the actual life of flip chip is...
This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates...
Along with electronic products developing toward lighter, thinner, and multi-functional integration, chip scale package (CSP) has been widely used in electronic packages. Wafer level packaging (WLP) has become one dominant technology. However, applications of WLP are limited by solder joint fatigue due to stress generated by the CTE mismatch among different materials. Compliant wafer level packaging...
Thermal fatigue life of PBGA (plastic ball grid array) solder joint on the FPC (flexible printed circuit) was analysed based on finite element analysis. According to symmetry theory, a quarter finite element model of 144-PIN PBGA was established. Both the stress and strain of lead and lead-free PBGA solder joints on the flexible PCB with the basic material of polyimide were studied by non-linear finite...
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