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The solder joints model structure of SMT has been established. The general rules of three different positions(the shallow surface, the internal and the interface of solder and pad)were discussed. Then, the finite model has been checked by the combination of experiment and simulation. Finally, through the multi points scanning method, the heat source was applied to heat the solder joints, the temperature...
This study was aimed at quantifying critically relevant topics about the influence of intermetallic compounds (IMC) within power electronics reliability such as the influence of soldering profile on the growth rate of IMC in large area solder joints, estimation of IMC thickness during non-isothermal ageing and the impact of IMC thickness on reliability. To this end, test samples were soldered using...
Interconnect reliability of wafer level packages (WLP) is one of the major concerns because of the direct connection of die to board without any substrate interposer. The dominant failure modes due to temperature cycling and drop include cracks in bulk solder, crack at pad to IMC interface, and RDL cracking at UBM interface. A number of factors affect this reliability; such as UBM/Pad size, bump density,...
In this paper, a user behavior based solder joint reliability modeling approach has been proposed to estimate the design and test requirements for the second level interconnect (SLI) reliability prediction. This approach uses a numerical tool to integrate solder joint creep damage during the actual use condition that was collected from a large user sample size. The resultant damage per time period...
In recent years, electronic product have been demanded more functionalities, miniaturization, higher performance, reliability and low cost. Therefore, IC chip is required to deliver more signal I/O and better electrical characteristics under the same package footprint. None-Lead Bump Array (NBA) Chip Scale Structure is then developed to meet those requirements offering better electrical performance,...
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temperature distribution in solder bump of micro bump is nearly uniform. In addition, the hot side is near the substrate side, whereas the cold side is near...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature...
Further miniaturization of electronic systems is approaching new limits due to the failure mechanism of electromigration. Electromigration results in a transport of material in solder joints subjected to high electrical current densities. This decreases the system reliability and, therefore, it is necessary to assess and quantify this failure mechanism in solder joints. In this paper we discuss the...
This paper uses a statistical approach to simulate the yield loss due to HIP (head-in-pillow) based on experimental work including production data. Detailed analyses on the HIP formation and mechanism were performed using Surface Evolver and optical measurement. Stackup analysis using statistical modeling and Monte Carlo simulation is performed to assess the magnitude of yield loss. From this study,...
The present stage of development of electronics technology there is an increased interest in the study of new materials used as solder that replaces the already banned tin-lead alloy. Many investigations were done in direction of metallurgic compatibility between the printed circuit board finishing, component terminal finishing and solder itself. Other studies are taken in direction of mechanical...
This paper deals with the functional reliability study of a new 16 A - 600 V high-temperature TRIAC family, subjected to power cycles, simulating the component in harsh real operation conditions. The targeted application is a vacuum cleaner (1800 W - 230 V - 50 Hz). In this kind of application, one of the major issues for TRIAC, which leads to high mechanical stresses for the assembly, occurs when...
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