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The research and design of liquid-cooled integrated circuits (IC) relies heavily on accurate simulation. Ideally, finite-element-method (FEM) based tools should be used for this purpose. However, in most cases a fully coupled thermo-fluidic simulation of complex ICs is very time consuming. Therefore, in this paper we propose a novel method for thermal simulation of ICs cooled by integrated microchannels...
This paper presents the scope of applicability of Dual-Phase-Lag model in modern electronic structures. Moreover, the investigation of obligatory application of this model, instead of the classical approach based on Fourier-Kirchhoff model, to heat transfer modeling is included. Furthermore, the modified Fourier-Kirchhoff thermal model, containing the special time lag parameter, is also taken into...
This paper includes the analyses related to the thermal model order reduction. The simplified, one-dimensional structure is investigated. The reduction technique based on the moment matching is employed. For this purpose, the Krylov-subspace-based model order reduction method is used. The generation of the reduced Dual-Phase-Lag heat transfer model is carried out using the Arnoldi algorithm. The temperature...
This paper demonstrates, based on a practical example of a test hybrid circuit, the importance of proper modeling of the heat transfer coefficient dependence on the surface temperature rise and fluid velocity in air cooled electronic systems. Hybrid circuits usually have large surface area and consequently important temperature gradients could occur in them, hence the local values of the heat transfer...
Silicon carbide MOSFETs coming from every manufacturer selling on the market have been simulated using models provided by the respective manufacturers. Simulation results have been compared to datasheet characteristics. Discrepancies were identified and their possible causes have been investigated. This has been complemented with an analysis of each model structure. For model improvement, several...
This work compares four SiC power MOSFET models for SPICE provided by main device manufacturers: STMicroelectronics, CREE and ROHM. Model complexity and structures are analysed. Model accuracy is assessed by comparing simulation results to static output characteristics given in the respective device datasheets.
In this paper participation of DMCS in design of the first Polish ASIC for space applications is presented, along with introduction to research projects focused on analysis of most important phenomena and their novel mathematical description demanded by modern deep sub-micron semiconductor processes.
In early stage of the design process, modelling is a crucial phase because it allows the designer estimating the device performance before fabrication. Very often, this phase is performed with use of FEM simulator that is usually time consuming. In many cases, especially when simple structures are used, the use of analytical model is more convenient. In this paper we present an analytical model of...
In early stage of the design process, modeling is a crucial phase as it allows the designer estimating the device performance. Very often, this phase is time-consuming, especially when FEM simulator is used. Hence, a fast and reliable method is desirable. Moreover, in case of simple structures which behavior is described with quite simple equations, the use of analytical model is obvious. In this...
This paper shows the thermal analyses of the latest 12 nm FinFET transistors. The simulated structure was based on the chips developed and applied in modern devices designed in Samsung 14 nm Samsung Low Power Early technology. The structure, which is taken into consideration, is the fourfold FinFET transistor including its ambient. In order to simplification of the analysis, the assumption related...
This paper presents the Finite Difference Method solution of Dual-Phase-Lag heat transfer model appropriate for a thin one-dimensional problems with a heat flux heating on the one side and a fixed reference temperature on the other side. The simulation results are shortly compared with Fourier-Kirchhoff heat equation model.
This paper presents the Green's function solution of the dual-phase-lag heat equation. The solution is derived for a thin one-dimensional slab heated on one side by a heat flux and cooled on the other side by the imposed isothermal boundary condition. The simulation results are compared with the ones obtained previously for the Fourier-Kirchhoff heat equation.
This paper presents the detailed analysis of a Green's function solution of the hyperbolic heat equation, which is derived for a thin one-dimensional benchmark structure heated on one side by a heat flux and cooled on the other side by the imposed isothermal boundary condition. The Green's function for the considered structure is obtained with the images method and the temperature solution is determined...
In this paper an extension of thermal influence coefficients method to frequency domain has been presented. The method allowed the steady-state analysis of three-dimensional heat flow in multilayered structures. The presented modelling is based on Fourier and Hankel transforms, two-port network theory and correction coefficients for close-area distances, allowing emulation of finite heat sources by...
A comprehensive approach to generation of electrothermal models of silicon carbide (SiC) power Schottky diodes is presented. Both the electrical and thermal parts of the model are behavioral. The electrical one was developed in order to accurately represent the nonlinear properties of SiC merged PiN Schottky (MPS) diodes. Its parameters are automatically obtained with a dedicated numerical procedure...
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