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In this work, we use a mostly analytical approach of Foldy-Lax multiple scattering equation method to efficiently model and solve physical/electromagnetics properties of the structures of SIW based devices and 3D IC in chip-package-board system which include multiple vertical and horizontal interconnects. We decompose the modes effects inside the target structures into modes of cavity with multiple...
Most of the via modeling methods assumed that only the TEM mode which is the fundamental mode can propagate due to the thickness of substrate being electrically small, and all the higher order waveguide modes and anisotropic modes decay rapidly along the radial direction thus they can be ignored. However, for high speed chip and die level packaging system, due to the interested frequency range is...
In this paper, we model multiple vias with irregular antipad in arbitrarily shaped 3-D integrated circuit and packaging system based on generalized Foldy–Lax equations method, boundary integral equation method, and generalized T matrix. We first obtain the impedance matrix for finite cavity, which includes the reflection features of the cavity boundaries. Then, the scattered field from a single via...
In this work, we use a mostly analytical approach of Foldy-Lax multiple scattering equation method with a recent major improvement, 1D technology, to efficiently model and solve physical/electromagnetics properties of the structures of SIW based devices and 3D IC in chip-package-board system which include multiple vertical interconnects. We first use MoM with 1D discretization to obtain the surface...
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