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Conventional power electronic modules employ a direct bonded copper (DBC) substrate and multiple interface layers to dissipate heat. However, reliability issues arise due to the coefficient of thermal expansion (CTE) mismatch that exists between the metal, ceramic, and semiconductor materials in the conventional module. Significant performance enhancement can be achieved by eliminating the DBC and...
This study explores the feasibility of single phase liquid channel cooling, pin fin cooling and spray cooling techniques for heat removal from a power electronic substrate. The substrate is formed using an AlN layer directly bonded to an AlSiC heat sink with a copper circuit layer. With a comparative assessment of the three cooling techniques using analytical modeling, the heat transfer coefficient...
This paper demonstrates, for the first time, ultra-thin, panel laminate fan-out (LFO) and glass fan-out (GFO) packages with embedded copper heat spreaders and electromagnetic shields for packaging high-power RF ICs in much smaller form factors and at potentially much lower cost than current ceramic and metal flange packages. This unique double-sided package addresses the thermal dissipation requirements...
Power electronics devices can be limited in operation, and lifetime by the ability to remove heat and maintain low junction temperatures. A common architecture for power electronics devices is a circuit soldered onto a direct-bonded-copper (DBC) substrate, which is attached to a heat spreader or and heat sink. The removal of some of these interfaces and materials, however, can reduce the overall thermal...
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