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Despite its grave importance, it is observed that the measurement of quantity estimates in construction sites lacks reliability from the absence of clear standards, letting the estimates to be influenced by factors including the investigator, the participants, the experience of the investigator, field circumstances and field conditions (season). However, since the information of estimates in construction...
In lead-free rework, it is almost impossible not to affect other adjacent parts when applying an existing hot-gas rework to the removal/exchange of parts as they are packed together. The fine pitch BGA components might be heat-damaged by the hot-gas or distorted, while smaller, passive components might experience a distortion of the parts due to melting of soldered joints. In such cases, it would...
High sensitivity capacitive humidity sensor based on novel designed PI with cavity structure fabricated by MEMS technology is presented in this paper. The humidity sensor consists of a substrate with a cavity, a bottom electrode, a sensing layer, and a comb-shaped top electrode with branches. The cavity structure of the substrate was formed to protect the sensing material and improve reliability....
The formation of process-related bubbles that become entrapped inside the anisotropic conductive film (ACF) layer during bonding processes remains an issue. The formation of these bubbles is strongly influenced by the process variables, such as bonding pressure and bonding temperature. Therefore, bonding process variables of bonding temperature, bonding pressure, and type of flexible substrate (FS)...
Because of downsizing of electronic products and cost effectiveness, rigid substrate-flexible substrate (RS-FS) bonding technology using ACFs becomes more important as an alternative to socket type connectors and rigid/flex substrates. However, formation of process related bubbles, entrapped inside the ACF layer during bonding processes, is strongly influenced by process variables, such as a bonding...
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