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Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, brittle intermetallic compound or other issues. At present, Cu to Cu bonding methods have been wide developed, but the microcosmic mechanisms of Cu to Cu...
The molded underfill (MUF) process for system in package (SiP) assembly has been applied for years and is still in production. However, the shrinkage in package size, cost reduction and improving electrical performance are driving the development of dual side molding package. The development of dual side molding technology faces the challenge of moldability. The moldability is largely influenced by...
The system-in-Package (SiP) module market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by lower cost, smaller form factor, higher levels of integration and better performance. In addition, for handheld and mobile application the coreless substrate had been evaluated to replace buildup coded...
The Embedded die in substrate (EDS) market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by smaller form factor, better heat dissipating, and low noise emission, higher levels of integration and better performance. In addition, for power management and mobile-wireless application the embedded...
The Embedded die in substrate (EDS) market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by smaller form factor, better heat dissipating, low noise emission, higher levels of integration and better performance. In addition, for power management and mobile-wireless application the embedded technology...
In this paper, the interface adhesion and reliability between copper lead frame(C-19210) and resin prepreg material of different copper lead frame lamination pretreatment processes (CZ and brown oxide) was studied. Surface morphology, roughness, peel strength and moisture sensitivity level, MSL3, reliability tests were performed in order to investigate the performance between these pretreatment procedures...
This work examines numerous significant process parameters in the solvent-assistant Polymethyl methacrylate (PMMA) bonding scheme and presents two Micro-total-analysis System (μ-TAS) devices generated by adopting the optimal bonding parameters. The process parameters considered were heating temperature, applied loading, duration and solution. The effects of selected process parameters on bonding dimensions...
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