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▪ Commercial Cloud Servers and High Performance Computing (HPC) need higher data rate short distance links — 100% of Fiber Cables in Blue Gene Q Sequoia (20 PFlop system) < 23 m — 100% of Fiber Cables in largest Power 775 system < 28 m — Data Centers also have a lot of very short distance links ▪ Directly modulated VCSELs and Multimode fiber will satisfy Server, HPC and some datacenter needs...
This tutorial will cover the use and application of directly modulated Vertical Cavity Surface Emitting Lasers (VCSELs), high speed direct detection receivers and multi-mode fiber for data centers and High Performance Computing (HPC) applications. Topics will include packaging, advances in modulation performance to 71 Gb/s and 50 Gb/s high temperature operation to 90C, higher fiber bandwidth density...
We report on an 850nm VCSEL based link operating error free to 71 Gb/s using an NRZ modulation format. This optical link uses custom transmitter and receiver ICs with 2-tap Feed Forward Equalization implemented in 130nm BiCMOS and GaAs based VCSELs and photodiodes. This paper covers new aspects of the circuits and packaging.
The Datacom industry has adopted 50–56Gb/s (50G) as one of the next data rates for short reach communications. This talk will cover the status of directly modulated VCSELs for 50G in the wavelength range of 850–1100 nm for multimode fiber and at 1550 nm for single mode fiber.
We demonstrate a 1530 nm VCSEL that can operate error-free without DSP or FEC to 56 Gb/s. At 50 Gb/s, error-free operation is attained up to 2 km of SMF. A 2-tap FFE driver is used to pre-compensate the VCSEL.
We report on the design, fabrication, packaging and characterization of a 4-channel semiconductor optical amplifier (SOA) flip-chip mounted on a photonic carrier. Significant loss occurs across high radix silicon photonic switching platforms due to multiple switching stages, waveguide crossings and I/O coupling elements. To overcome these losses, we propose the hybrid integration of a III–V SOA onto...
A novel optical transceiver with 4 transmitter plus 4 receiver channels designed for coupling to multicore multimode fiber has been fabricated and characterized. The transceiver is based on the holey Optochip concept where 4-channel VCSEL and photodiode arrays are flip-chip attached to a single-chip SiGe IC using AuSn solder. Optical vias (holes) are fabricated into the SiGe IC to enable optical access...
Investigation of connector performance for D-shaped multi-core MMF found that worst case equivalent connector offset >5.5µm is possible with >2dB loss. Statistical simulations indicate that with proper launch conditions less than 0.75dB loss is possible.
This paper reports on the evaluation of high-speed signaling performance of multilevel metallic interconnects on glass substrates. The wafer fabrication, transfer process, and passive electrical characterization of interconnects are addressed. Measurement results demonstrate less than 5 dB/cm insertion loss below 20 GHz. Moreover, 2-level wiring on glass with inter-level vias is utilized to implement...
Optical 4 + 4 transceivers based on holey Optochip design using IBM BiCMOS8HP technology have been successfully assembled and characterized. The transceiver Optochip consists of an 8-channel single chip SiGe IC, containing all of the transmitter (TX) and receiver (RX) amplification circuitry, with flip-chip attached 4-channel VCSEL and photodiode arrays. Optical access to the conventional topside...
A compact optical transceiver module providing 0.48 Tb/s transmitter plus 0.48 Tb/s receiver throughput has been demonstrated using a second-generation single-chip holey CMOS transceiver IC. The single-chip CMOS transceiver IC designed in standard 90nm IBM CMOS has 24 receiver and 24 laser driver circuits each with a corresponding through-substrate optical via (hole). The forty-eight 150-um diameter...
A receiver based on Ge waveguide photodetector wire-bonded to 90nm CMOS amplifier built in specialty SOI wafer demonstrates error-free operation up to 40Gbps. At 25Gbps the receiver achieved a sensitivity of −8.3dBm with 3.3pJ/bit power-efficiency.
Optical interconnects offer significant advantages for future high performance data center networks. Progress towards integrating new optical technologies deeper into systems is reviewed, and the prospects for optical architectures beyond point-to-point optical links are discussed.
A novel, compact 48-channel optical transceiver module has been designed and fabricated. At the heart of the assembly is a “holey” Optochip — a single-chip CMOS transceiver integrated circuit (IC) with 24 receiver and 24 laser driver circuits each with a corresponding through-substrate optical via (hole). The holes enable 24-channel 850-nm VCSEL and photodiode (PD) arrays to be directly flipchip soldered...
We report the optical interconnect for POWER7-IH systems, which provides high-BW, low-latency connectivity for 100,000s of high-performance CPU cores by leveraging dense transceiver and connector technologies to construct chip module optical IOs.
24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS "holey" 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.
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