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We present the design, fabrication, and measurement results of low-insertion-loss and low-crosstalk broadband $2\times 2$ Mach–Zehnder switches for nanosecond-scale optical data routing applications. We propose a simulation framework to calculate the spectral characteristics of switches and use it to design two switches: one based on directional couplers, the other using two-section directional couplers...
A novel optical transceiver with 4 transmitter plus 4 receiver channels designed for coupling to multicore multimode fiber has been fabricated and characterized. The transceiver is based on the holey Optochip concept where 4-channel VCSEL and photodiode arrays are flip-chip attached to a single-chip SiGe IC using AuSn solder. Optical vias (holes) are fabricated into the SiGe IC to enable optical access...
Optical 4 + 4 transceivers based on holey Optochip design using IBM BiCMOS8HP technology have been successfully assembled and characterized. The transceiver Optochip consists of an 8-channel single chip SiGe IC, containing all of the transmitter (TX) and receiver (RX) amplification circuitry, with flip-chip attached 4-channel VCSEL and photodiode arrays. Optical access to the conventional topside...
A compact optical transceiver module providing 0.48 Tb/s transmitter plus 0.48 Tb/s receiver throughput has been demonstrated using a second-generation single-chip holey CMOS transceiver IC. The single-chip CMOS transceiver IC designed in standard 90nm IBM CMOS has 24 receiver and 24 laser driver circuits each with a corresponding through-substrate optical via (hole). The forty-eight 150-um diameter...
A novel, compact 48-channel optical transceiver module has been designed and fabricated. At the heart of the assembly is a “holey” Optochip — a single-chip CMOS transceiver integrated circuit (IC) with 24 receiver and 24 laser driver circuits each with a corresponding through-substrate optical via (hole). The holes enable 24-channel 850-nm VCSEL and photodiode (PD) arrays to be directly flipchip soldered...
24-channel 850-nm VCSEL and PD arrays are flip-chip soldered to 90-nm CMOS "holey" 48-channel 12.5-Gb/s/channel transceiver chip, featuring through-substrate holes for optical I/O. Aggregate 300-Gb/s bi-drectional data rate is highest reported for single-chip transceiver modules.
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