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Plated through holes provide conductive connection among different copper layers, and mechanical support for components. Plated through hole process includes many steps such as drill, desmear, micro-etch and electroless copper plating. Improper control of any step will lead to plated through hole defects. In the present study, an open circuit failure caused by one of plated through hole defects, inner-layer...
X-ray imaging provides direct visualization of sample's internal structures and defects. Operation principles of two-dimensional X-ray and three-dimensional X-ray computer tomography are described. Two-dimensional X-ray provides real time imaging of samples, while three-dimensional X-ray computer tomography technology can reconstruct the three-dimensional image of the sample through processing a large...
In this paper, the effect of gold amount on the gold embrittlement of solder balls in wafer-level chip-scale package (WLCSP) CSP 80 is investigated. First, precisely controlled amounts of gold were added artificially to solder balls through a reflow process. It is found that for CSP 80 without Au, after 2000 h of thermal aging at 150 degC, the solder balls still fail in the bulk solder. When Au is...
In this study, flip chip (FC) daisy chain test dies with Sn- Ag-Cu solder bumps on Al/Ni(V)/Cu UBM were subjected to a high temperature storage (HTS) test at 175degC for up to 2000 hours. Solder bump shear tests were then performed and the electrical resistance of a daisy-chain pair of solder bumps was measured to investigate the effect of high temperature storage on the reliability of Sn-Ag-Cu solder...
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