Search results for: Hanju Oh
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 7 > 1003 - 1010
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 502 - 510
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2510 - 2516
IEEE Transactions on Electron Devices > 2016 > 63 > 6 > 2503 - 2509
IEEE Transactions on Electron Devices > 2016 > 63 > 3 > 1176 - 1181
IEEE Microwave and Wireless Components Letters > 2016 > 26 > 3 > 168 - 170
2015 International 3D Systems Integration Conference (3DIC) > TS11.3.1 - TS11.3.4
Microelectronic Engineering > 2015 > 142 > Complete > 30-35