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One challenge concerning the reliability of ball grid array (BGA) packages assembly is to detect the void defects occurring inside solder balls. Additionally, for use in mass production, an automated inspection system has increasingly become an attractive solution. In practice, the first procedure of this system is required to segment the individual solder balls from the background. Here, we have...
In this paper, we present the noise reduction method for a multichannel measurement system where the true underlying signal is spatially low-rank and contaminated by spatially correlated noise. Our proposed formulation applies generalized singular value decomposition (GSVD) with signal recovery approach to extend the conventional subspace-based methods for performing the spatio-temporal filtering...
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