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As a common problem in wafer lever packaging(WLP), wafer warpage caused by heat process should be carefully controlled in case of product inaccuracy or yield loss, and redistribution layer (RDL), as a key structure of WLP, is one of the major concerns that causes warpage. In this paper, a novel RDL tailored by pulsed electrodeposited nanotwinned copper (nt-Cu) was introduced into WLP. It was found...
Redistribution layer (RDL) composing of polyimide (PI) dielectric layer and electro-chemical deposited (ECD) Cu trace is a critical part for wafer level packaging (WLP). One concern of this multi-layered film structure is the wafer warpage induced during the process, which poses threats to automatic handling, 3-D integration and device reliability. In this paper, the warpage origination during the...
Thick polyimide film and electroplated Cu lines are widely adopted in redistribution layer of wafer level packaging. One potential reliability problem is the stresses generated in the thermal process. In this paper, the evolution of thermal stresses and plastic strain in two-level interconnections in redistribution layer of WLP was analyzed by recourse to the finite element analysis and Taguchi method...
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