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A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element...
The influence of viscoelastic behavior of polybutylene terephthalate (PBT) on reliability of the thermal contact of a spotlight module is evaluated. The contact between a module and the heat sink is evaluated using non-linear finite element model. The viscoelastic behavior of PBT was obtained under multiple frequencies from single cantilever DMA experiments. The relevant viscoelastic parameters (i...
The influence of viscoelastic behavior of polybutylene terephthalate (PBT) on reliability of the thermal contact of a spotlight module is evaluated. The contact between a module and the heat sink is evaluated using non-linear finite element model. The viscoelastic behavior of PBT was obtained under multiple frequencies from single cantilever DMA experiments. The relevant viscoelastic parameters (i...
A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element...
Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the...
In this paper, a 3 W high power LED array system with an in-line pin fin heat sink is designed, fabricated, and investigated for thermal transient analysis. Preliminary finite element simulation is conducted by ANSYS, and LED array average junction temperature is about 40.9°C. In the experiment, electrical test method is used to evaluate the heat dissipation effect of the LED array system. Experiment...
MEMS (Micro Electro-Mechanical System) is a technology that offers significant advantages over various microscopic elecromechanical devices. In the field of MEMS products, pressure sensor represents a considerably mature technology and has been extensively used in a variety of applications. Nevertheless, packaging is a key issue among the processes of MEMS manufacture due to the specialty and complexity...
An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning...
The superconducting magnet of the LPT (Lanzhou Penning trap) consists of nine coaxial coils. The maximum magnetic field is 7 T and thus results in a large magnetic force. In order to assure the mechanical stability, it is necessary to do the stress analysis of the magnet system. The 3D Finite Element Analysis of thermal and mechanical behavior was presented in this paper. For the numerical simulation...
High frequency bending mode membranes are fabricated using a 1 mum PZT thick film deposited by sol-gel. Finite element analysis (FEA) is used to tailor the membrane radius to a resonant frequency in the 5-10 MHz frequency range. Using a radius of 16 and 24 mum, devices are produced as individual cells as well as 3 times 3 and 5 times 5 arrays. The arrays are designed so that the bottom electrode is...
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