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The microstructural and mechanical properties of Sn-3.0Ag-0.5Cu lead-free solders added with a porous Cu interlayer were investigated. Two types of porous Cu, P15 and P25 with the diameter of ϕ1.7 mm and ϕ1.0mm respectively were used in this study. The porous Cu was arranged in a sandwich-liked layer in between Sn-3.0Ag-0.5Cu solder alloys with rod Cu as a substrate metal. Solder joint without porous...
In this paper, the effect of adding porous Cu to Sn-based solder on the joint strength of the solder alloy was investigated. The porous Cu was arranged in a sandwich-liked layer with Sn-based solder alloys. The soldering process involved different soldering temperature and time. Shear test was also performed to evaluate the joint strength of the solder alloy for both with and without addition of porous...