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In this paper a kind of SSPC was designed and fabricated using thick film hybrid circuit technology. More than 1000 SSPC products went through the screening test according to GJB2438A. The screening procedure including thermal shock, high temperature power burn-in test, constant acceleration, hermetic sealing test and particle impact noise detection (PIND). Also 1000h life test was applied to samples...
The package-on-package(PoP) stacking technique with the advantages of printed-circuit-board(PCB) space saving, flexible combination and assembly has become a kind of mainstream solution for the high density package. However, the conventional PoP technology is limited with constraint aspect ratios of I/O density between the top and base packages under conventional solder ball interconnection approach...
The use of capsule endoscope greatly contributes to the painless and hygiene diagnoses of the small intestine, which cannot be reached easily by traditional upper endoscopy or colonoscopy. However, most of current commercial capsule endoscopes only carry one or two cameras, which may lead to missing some interesting spots due to the limited field of view. A micro-ball endoscope with six CMOS image...
In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages.
Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer was introduced. Different materials and process were compared. RF MEMS using TGV wafer was designed.
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