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The use of capsule endoscope greatly contributes to the painless and hygiene diagnoses of the small intestine, which cannot be reached easily by traditional upper endoscopy or colonoscopy. However, most of current commercial capsule endoscopes only carry one or two cameras, which may lead to missing some interesting spots due to the limited field of view. A micro-ball endoscope with six CMOS image...
In this paper a four-layer package-on-package(PoP) stacking structure was introduced which allowed the whole package using fine pitch solder ball and consequently improved the interconnection I/O density between the neighboring packages.
Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer was introduced. Different materials and process were compared. RF MEMS using TGV wafer was designed.
As the development of electronic devices, three-dimensional (3D) integration is the next generation of electrical packaging technique. Glass is another excellent material for packaging with lots of advantages. In this paper, we introduce novel tungsten filled through glass via wafer, simulated electronic characters and its application on MEMS.
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