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In 2.5D ICs, the number of metal layers in the interposer contributes strongly to its manufacturing costs. Many systems implemented as 2.5D ICs include component dies, e.g. FPGA dies, that have flexible interconnect that increase connectivity options within the 2.5D IC. We present the first work to leverage flexible interconnect in FPGA dies within a 2.5D IC to decrease routing metal layers in the...
This paper presents a problem formulation and procedure for design automation of 2.5D interposer-based multi-die ICs. Our approach is designed for (but not limited to) 2.5D ICs that contain one or more dies with flexible I/Os — such as FPGA dies. Given a set of dies, inter-die connections, I/O standard(s) for the connections, and a set of valid die pins for the connections, we simultaneously place...
Embedded systems often contain many components, some with multiple Field Programmable Gate Arrays (FPGAs). Designing Printed Circuit Boards (PCBs) for these systems can be a complex process that is often tedious, error-prone, and time-intensive. Existing computer-aided design tools require designers to manually insert components and explicitly define the connections between every component on the...
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