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Light emitting diodes (LEDs) has presented its outstanding performance compared to other present lighting sources such as fluorescent and incandescent. Thus, LEDs has become the favourable lighting source in this decade. However, the heat generated from the LEDs has limited its overall performances. This paper has demonstrated the use of simulation technique to access the thermal performance of the...
Digital fringe projection method are emerging as evaluation tool of human forms in biomedical field due to its non-contact, non-invasive nature and provides whole field measurements. Nevertheless, its application for breast carcinoma detection is relatively minimal. Thus, in this work, a novel application of digital fringe projection for breast carcinoma detection is reported based on phase shift...
High brightness light emitting diodes, LEDs are the latest generation of solid-state lighting devices. These LEDs portray good luminous efficiency and energy saving properties when compared with the conventional lights. Despite the advantages of the LEDs, it is important to dissipate the heat generated by the PN junction of the LED to enviroment as trapped heat in the LED package will degrade the...
Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper...
LEDs are being utilized as lighting source due to its superior advantages over incandescent lamps in terms of higher efficiency, brighter light emission and longer lifetime. However, the reliability and efficiency of the LED is dependent on the junction temperature of the LED chip. Hence, the heat dissipation of single chip LED package with aluminum heat slug was investigated through simulation in...
High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation...
A revolution to illumination industry, the high power light emitting diodes, LEDs have significant dominance in terms of optical performance, low power consumption and superior reliability over conventional lights. In spite of that the junction temperature of the LED is an imperative aspect which manipulates the consistency of the LED. This study discusses the thermal and stress analysis of single...
Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys...
As the trend for semiconductor packaging is heading towards BGA and flip chip interconnection methods, the conventional wire bonding process still dominates the industry primarily due the flexibility of wire bonds. The reliability of the bonded wires is assessed through wire bond shear test. In this study, the effects of shear ram speed on the stress response of bonded wires during wire bond shear...
The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation....
As the trend of integrated circuit is lashing towards miniaturized facet, wire bonding interconnection is still vastly being utilized in the first level of electronic packaging. The bond strength of the bonded wires is scrutinized by wire bond shear test. Hence in this paper, the effects of bond pad surface on the stress response of gold ball bond during wire bond shear test were investigated through...
Wire bonding is one of the commanding interconnection techniques used at the back end of line due to its vast adaptability to the advancing trend of circuit designs. Wire bond shear test method is utilized to examine adhesion strength of the bonded wires. In this paper, the stress response of copper ball bond during wire bond shear test is investigated The influences of three types of bond pad surface;...
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