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Light emitting diodes (LEDs) has presented its outstanding performance compared to other present lighting sources such as fluorescent and incandescent. Thus, LEDs has become the favourable lighting source in this decade. However, the heat generated from the LEDs has limited its overall performances. This paper has demonstrated the use of simulation technique to access the thermal performance of the...
Digital fringe projection method are emerging as evaluation tool of human forms in biomedical field due to its non-contact, non-invasive nature and provides whole field measurements. Nevertheless, its application for breast carcinoma detection is relatively minimal. Thus, in this work, a novel application of digital fringe projection for breast carcinoma detection is reported based on phase shift...
High brightness light emitting diodes, LEDs are the latest generation of solid-state lighting devices. These LEDs portray good luminous efficiency and energy saving properties when compared with the conventional lights. Despite the advantages of the LEDs, it is important to dissipate the heat generated by the PN junction of the LED to enviroment as trapped heat in the LED package will degrade the...
The reliability performance and structural of the solder joint on the Ball Grid Array (BGA) has become an important concern, due to increasing demand of electronic devices. The reliability of the BGA are evaluated through shear test. Different parameters of the ball shear test will cause the change on stress and strain. In this paper, a simple shear test on a single solder ball joints on Ball Grid...
Enhancing the reliability Ball grid array (BGA) is significant due major contribution as an interconnection in the electronic devices. Due to the compactness of the electronic devices, ball grid array (BGA) interconnection methods are utilized as passage to transmit power and signals within the electronic. However, the reliability of the BGA is very significant as it has a direct effect on the performance...
Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper...
Wire bonding are utilized as 1st level interconnection in all electronic devices. The reliability of the bonded wires are assessed by wire bond shear test. In this paper the evaluation of the stress and strain response of the gold ball bond during wire bond shear test using finite element analysis is presented. A 3D non-linear finite element model was developed for the simulation. The effects of the...
LEDs are being utilized as lighting source due to its superior advantages over incandescent lamps in terms of higher efficiency, brighter light emission and longer lifetime. However, the reliability and efficiency of the LED is dependent on the junction temperature of the LED chip. Hence, the heat dissipation of single chip LED package with aluminum heat slug was investigated through simulation in...
High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation...
Shear height has substantial effect on the solder ball shear strength. In recent times, taking environmental issue into consideration, Lead free solder joint must be developed. In this paper, the load effect of different shear heights with fixed shear speed of a single solder joint on Ball Grid Array (BGA) is presented through simulation. A Lead free material, Sn-3.9Ag-0.6Cu was adopted as solder...
The reliability of the solder joints of Ball Grid Array is severely tested during the exposure of thermal operation due to coefficient of thermal expansion (CTE). Different thermal expansion due to this mismatch causes shearing effects to the solder joints. This paper compares the shearing speed on stress and strain between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu solder ball. A full factorial design of...
Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single solder joint with varied parameters are briefly...
A revolution to illumination industry, the high power light emitting diodes, LEDs have significant dominance in terms of optical performance, low power consumption and superior reliability over conventional lights. In spite of that the junction temperature of the LED is an imperative aspect which manipulates the consistency of the LED. This study discusses the thermal and stress analysis of single...
Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys...
As the trend for semiconductor packaging is heading towards BGA and flip chip interconnection methods, the conventional wire bonding process still dominates the industry primarily due the flexibility of wire bonds. The reliability of the bonded wires is assessed through wire bond shear test. In this study, the effects of shear ram speed on the stress response of bonded wires during wire bond shear...
Tremendous effort is put into enhancing reliability of Ball grid array (BGA) solder joints. The BGAs are utilized as interconnection method in the electronic packaging industry due to its vast advancement in circuit miniaturization. New materials are introduced to further improve the reliability of the BGA solder joint. In this study, the stress response of BGA solder ball during vertical loading...
Study on microfluid flow characteristic can be useful for most practical engineering application such as flows in inkjet printhead, drug delivery devices and microthermal technologies. Hence, in this paper, simulation of microfluid flow in Backward Facing Step (BFS) microchannel has been performed to visualize the flow characteristic at the step region. The microchannel used in this simulation has...
The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation....
Miniaturization trend has been the core catalyst in application device development. In the fluid flow applications have been carved and mirrored to biological micro fluid flow. Microfluidics is an emerging field where extensive applications are being explored namely in biomedical and electronics.In this paper, simulation of liquid flow in Backward Facing Step (BFS) microchannel was investigated to...
As the trend of integrated circuit is lashing towards miniaturized facet, wire bonding interconnection is still vastly being utilized in the first level of electronic packaging. The bond strength of the bonded wires is scrutinized by wire bond shear test. Hence in this paper, the effects of bond pad surface on the stress response of gold ball bond during wire bond shear test were investigated through...
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