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This work introduces two new metallization schemes using the electroless deposition (ELD) technique; one based on contact fill and one based on via prefill. One of the key features of the electroless process is its selective deposition, which can be used for bottom-up fill of high aspect ratio features. The feasibility of this Co ELD process is demonstrated on contacts landing on W and vias landing...
An analytic model for the endurance degradation of metal oxide based RRAM is presented for the first time. The endurance degradation behaviors under various operation modes can be predicted by the model, which were verified by the measured data in different devices. Furthermore, the 106 endurance for all 4-level resistance states in HfOX-based RRAM is demonstrated by using the proposed optimization...
Both unipolar and bipolar resistive switching behaviors are demonstrated and investigated in the TaTiN/HfOx/Pt structured RRAM devices. A physical model based on the recombination among the electron-depleted oxygen vacancies (VO2+) and the oxygen ions (O2-) released from the TaTiN electrode is proposed to clarify the co-existed bipolar and unipolar resistive switching effect. In the proposed physical...
Several approaches of solid phase epitaxy (SPE) formed embedded SiC (eSiC) scheme have been investigated on 28 nm node technology. The single SPE thermal process by LSA only with post S/D scheme is reported to accommodate high carbon concentration as well as low sheet resistance in this work. Cluster carbon with tilted angle implantation is designed to further simplify process and increase channel...
The multi-level operation of WOx based RRAM has been investigated. Improvement of our WOx process has produced an extended linear R-V region for our devices. By adding an electrical forming process and a program-verify algorithm we have demonstrated stable 2-bit/cell operation, with potential for 3-bit/cell. The reliability of the MLC operation has been examined and very stable high temperature retention,...
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